LMT028ENHFWA
LCD Module User Manual
Prepared by:
Checked by:
Approved by:
Li KeKe
Date: 2020-01-11
Date:
Date:
Rev.
Descriptions
Release Date
0.1
Preliminary New release
2020-01-11
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Table of Content
1. Basic Specifications....................................................................................................................3
1.1 Block Diagram………………………………………………………………………………………………………………………3
1.2 Terminal Functions………………………………………………………………………………………………………………….4
2. Absolute Maximum Ratings........................................................................................................5
3. Electrical Characteristics............................................................................................................5
3.1 DC Characteristics………………………………………………………………………………………………………………...5
3.2 LED Backlight Circuit Character istics…………………………………………………………………………………………...5
3.3 AC Characteristics………………………………………………………………………………………………………………...6
3.4 Reset Timing……………………………………………………………………………………………………………………….8
4. Functions 9
4.1 Display Commands………………………………………………………………………………………………………………....9
4.2 Power off the LCD Module……………………………………………………………………………………………………….13
4.3 Refreshing The LCD Module…………………………………………………………………………………………………….13
5. Optical Characteristics..............................................................................................................14
6. LCD Module Design and Handling Precautions......................................................................16
7. CTP Mounting Instructions.......................................................................................................17
8. RTP Mounting Instructions.......................................................................................................18
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1. Basic Specifications
Screen Size(Diagonal) :
2 .8”
Color Depth:
65k colors
Number of dots :
240 (RGB) x 320
Active Area :
43.2x57.6 mm
Dot Pitch :
0.18x0.18 mm
Display Technology :
a-Si TFT active matrix
Display Mode :
Transmissive with Normally black
Pixel Configuration :
RGB Stripe
Viewing Direction :
Full View
Backlight Type:
LEDs
Outline Dimension :
48.4 x 69.2 x 2.5 mm (exclude FPC)
(see dwg for details)
Operating Temperature :
-20 ~ +70°C (No Condensation)
Storage Temperature :
-30 ~ +80°C (No Condensation)
Note:
1. Color tone may slightly change by temperature and driving condition.
1.1 Block Diagram
LEDA
Backlight Circuit
LEDK1, LEDK2, LEDK3, LEDK4
240(RGB) x 320 pixels
TFT Panel
DB0~DB15
VCC, IOVCC, GND
TFT Driver
IM0,IM123
ST7789VI or equivalent
SCL,SDA,SDO
FMARK, /RESET, /RD, /WR, D/C, /CS
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1.2 Terminal Functions
Pin
Pin
Descriptions
No.
Name
I/O
80-16bit
80-8bit
4-SPI
1
LEDA
P
LED Anode
2
LEDK1
LED Cathode1
3
LEDK2
LED Cathode2
4
LEDK3
P
LED Cathode3
5
LEDK4
LED Cathode4
6
GND
P
Power Ground
7
VCC
P
Analog and Logic power supply
8
IOVCC
P
Interface power supply
9
IM123
IM123
IM0 MPU Interface Mode Data pin
0
0
80-8bit parallel I/F
DB[7:0]
10
IM0
I
0
1
80-16bit parallel I/F
DB[15:0]
1
0
SDA:in
4-line 8bit serial I/F Ⅱ
SDO: out
11
/RESET
I
Reset signal: active Low
Chip Select
12
/CS
I
/CS=L, enable access to the LCD interface
/CS=H, disable access to the LCD interface
D/C(SCL)
Register Select
13
I
D/C = H, Transferring the Display Data
D/C = L, Transferring the Control Data
/WR=L → H, /RD=H;
Display data/command
14
/WR(D/C)
I
Data or Instruction latch into the LCD module
selection pin in 4-line serial
interface.
15
/RD
I
/WR=H,/ RD=L;
Please fix this pin at VCC or
Data or Status read form the LCD module
GND
16
SDA
I
Please fix this pin at VCC or GND level.
The data is latched on the
rising edge of the SCL signal.
SPI interface output pin.
17
SDO
O
ould leave open
The data is output on the
rising edge of the SCL signal.
18
DB0
DB0
19
DB1
DB1
20
DB2
DB2
21
DB3
DB3
22
DB4
I/O
DB4
Please fix this pin at VCC or
23
DB5
Data Bus
DB5
GND level.
24
DB6
DB6
25
DB7
DB7
26
DB8
:
:
Connect
GND
33
DB15
34
FMARK
O
Frame mark Output signal(could leave open)
35
GND
P
Power Ground
36
NC/VPP
37
NC(YU)
38
NC(XR)
-
No connect
39
NC(YD)
40
NC(XL)
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2. Absolute Maximum Ratings
Items
Symbol
Min.
Max.
Unit Condition
Supply Voltage
VCC
-0.3
+4.6
V
GND = 0V
Logic Voltage
IOVCC
-0.3
+4.6
V
GND = 0V
Operating Temperature
T OP
-20
+70
C
No Condensation
Storage Temperature
T ST
-30
+80
C
No Condensation
Cautions:
Any Stresses exceeding the Absolute Maximum Ratings may cause substantial damage to the device. Functional oper-
ation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to
extreme conditions may affect device reliability.
3. Electrical Characteristics
3.1 DC Characteristics
VCC=3.3V, GND=0V, T OP =25 C
Items
Symbol
MIN.
TYP.
MAX.
Unit
Application Pin
Logic Supply Voltage
IOVCC
3.2
3.3
3.6
V
VCC,IOVCC
Input High Voltage
V IH
0.7
0.3
SDA,/RD,/WR,
IOVCC
-
IOVCC
V
D/C,/CS,/SCL,
IM123,IM0,
Input Low Voltage
V IL
-
-
1.0
V
/RESET,
DB0~DB15
Output High Voltage
V OH
0.8
IOVCC
-
-
V
DB0~DB15,
Output Low Voltage
V OL
-
-
0.2
SDO,FMARK,
IOVCC
V
Operating Current
I VCC
-
8.6
21.5
mA
VCC
3.2 LED Backlight Circuit Characteristics
LEDK(1~4)=0V, I LEDA =80mA, T OP =25 C
Items
Symbol
MIN.
TYP.
MAX.
Unit Application Pin
Forward Voltage
LEDA
-
3.3
-
V
LEDA
Forward Current
I LEDA
-
80
-
mA
LEDA
Cautions:
Exceeding the recommended driving current could cause substantial damage to the backlight and shorten its lifetime.
No. of LEDs = 4pcs
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3.3 AC Characteristics
8080 Mode System Bus Timing
VCC=3.3V, GND=0V, T OP =25
C
Signal
Symbo
Parameter
Spec.
l
Min.
Max.
Unit
Description
Address setup time
5
-
D/C
T AST
ns
-
T AHT
Address hole time(Write/Read)
13
-
T CHW
Chip select “ H ” pulse width
5
-
T CS
Chip select setup time(Write)
20
-
Chip select setup time(Read ID)
60
-
/CS
T RCS
ns
-
T RCSFM
Chip select setup time(Read FM)
460
T CSF
Chip select wait time(Write/Read)
13
T CSH
Chip select hold time
13
T WC
Write cycle
86
-
/WR
T WRH
Control pulse “ H ” duration
20
-
ns
-
T WRL
Control pulse “ L ” duration
20
-
T DST
Data setup time
13
-
For maximum
T DHT
Data hold time
13
-
CL=30pF
DB[15:0]
T RAT
Read access time(ID)
-
52
ns
For minimum
T RATFM
Read access time(FM)
-
442
CL=8pF
T ODH
Ouput disable time
14
104
T RC
Read cycle(ID)
208
/RD(ID)
T RDH
Control pulse “ H ” duration(ID)
120
When read ID data
T RDL
Control pulse “ H ” duration(ID)
60
ns
T RCFM
Read cycle(FM)
585
/RD(FM)
When read from
T RDHFM Control pulse “ H ” duration(FM)
120
frame memory
T RDLFM
Control pulse “ H ” duration(FM)
460
Note:
*1. Input signal rise/fall time should be less than 15ns .
*2. All timing is using 20% and 80% of VDD as the reference.
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*3. Please refer to ST7789VI datasheet for details
4 line SPI Timing
VCC=3.3,GND=0V,TOP =25
C
Note : The rising time and falling time (Tr, Tf) of input signal are specified at 15 ns or less. Logic high and low levels are
specified as 30% and 70% of VDDI for Input signals.
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3.4 Reset Timing
VCC=3.3V, GND=0V, T OP =25
C
Item
Symbol
MIN.
TYP.
MAX.
Unit
Reset LOW pulse width
t RW
10
-
-
us
Reset time
T RT
-
-
170
ms
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4. Functions
4.1 Display Commands
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Notes:
1.
There will be no abnormal visible effects on the display when S/W or H/W Reset are applied.
2.
Please refer to ST7789VI datasheet for details
4.2 Power off the LCD Module
It recommends that enter Sleep Mode before power off the LCD module.
4.3 Refreshing The LCD Module
It recommends that the operating modes and display contents be refreshed periodically to prevent
the effect of unexpected noise.
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5. Optical Characteristics
VCC=3.3V, GND=0V, T OP =25
C
Item
Symbol
Condition
Min
Typ
Max
Unit
Remark
θT
70
80
-
View Angles
θB
CR ≧ 10
70
80
-
Degree
Note2,3
θL
70
80
-
θR
70
80
-
Contrast Ratio
CR
θ = 0°
600
800
-
Note 3
T ON
Response Time
25 ℃
-
25
35
ms
Note 4
T OFF
x
0.237
0.287
0.337
White
y
0.265
0.315
0.365
x
0.586
0.636
0.686
Red
Chromaticity
Backlight is
y
0.286
0.336
0.386
Note 1,5
x
on
0.285
0.335
0.385
Green
y
0.564
0.614
0.664
x
0.099
0.149
0.199
Blue
y
0.021
0.071
0.121
Uniformity
U
75
80
-
%
Note 6
NTSC
S
Θ= 0°
65
70
-
%
Note 5
Luminance
L
Φ=0 o
230
280
-
cd/ ㎡ Note 7
1.I LEDA = 80mA, and the ambient temperature is 25 ℃ .
2. The test systems refer to Note 1 and Note 2.
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Note 1: Definition of optical measurement system.
Note 2: Definition of viewing angle range and measurement system.
The optical characteristics should be measured in dark room.
The definition of viewing angle:
After 5 Minutes operation, the optical
Refer to the graph below marked by θ and Ф
properties are measured at the center point of the LCD screen.
All input terminals LCD panel must
be ground when measuring the center area of the panel.
Measuring surroundings: Dark room
Measuring temperature: Ta=25 ℃ .
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Note 3: Definition of contrast ratio
Note 4: Definition of Response time
The definition of contrast ratio (Test LCM using SR-3A (1°)):
Definition of Response time.
Contrast
Luminance When LCD is at “White” state
The response time is defined as the LCD optical switching time
Ratio(CR)
=
Luminance W hen LCD is at “Black” state
interval between “White” state an d
(Contrast Ratio is measured in optimum common electrode
“ Black” state. Rise time (T ON ) is the time between photo detector
voltage)
output intensity changed from 90%
to 10%. And fall time (T OFF ) is the time between photo detector
output intensity changed from 10%
to 90%.
Note 5: Definition of color chromaticity (CIE1931)
Note 6: Definition of Luminance Uniformity
Definition of Color of CIE1931 Coordinate and NTSC Ratio.
Active area is divided into 9 measuring areas (Refer Fig. 2). Every
measuring point is placed at the
Color gamut:
center of each measuring area.
Area of RGB triangle
Luminance Uniformity (U) = Lmin/ Lmax
S=
X100%
Area of NTSC triangle
L-------Active area length W----- Active area width
Lmax: The measured Maximum luminance of all measurement
position.
Lmin: The measured Minimum luminance of all measurement
position.
Note 7: Definition of Luminance:
Measured the luminance of white state at center point
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6. LCD Module Design and Handling Precautions
6. 液晶显示模块设计和使用须知
-
Please ensure V0, VCOM is adjustable, to enable LCD module get the -
请注意 V0, VCOM 的设定 , 以确保液晶显示模块在不同的
best contrast ratio under different temperatures, view angles and
使用温度下以及在不同的视角和位置观察模块显示,均
positions.
能达到最佳对比度,请务必将应用电路上设置为对比度
可调。
-
Normally display quality should be judged under the best contrast ratio -
请注意液晶显示模块的显示品质判定是指在正常对比度
within viewable area. Unexpected display pattern may com out under
下以及视窗 (V.A) 范围内进行的,非正常对比度下液晶可
abnormal contrast ratio.
能会出现非预期的显示不良,应注意区分。
-
Never operate the LCD module exceed the absolute maximum ratings. -
请勿在最大额定值以外使用液晶显示模块。
-
Never apply signal to the LCD module without power supply.
-
请勿在没有接通电源的条件下,给液晶显示模块输送信
-
Keep signal line as short as possible to reduce external noise
号。
interference.
-
请尽可能缩短信号线的连接,以避免对液晶显示模块的
-
IC chip (e.g. TAB or COG) is sensitive to light. Strong light might cause
信号干扰。
malfunction. Light sealing structure casing is recommended.
-
集成电路因 IC 芯片 ( 如 TAB 或 COG) 对紫外线极为敏感,
强光环境下可能会引起液晶显示模块功能失效,故应采
-
Make sure there is enough space (with cushion) between case and
用不透光的外壳。
LCD panel, to prevent external force passed on to the panel; otherwise -
请在液晶显示模块与外壳之间保留足够的空间 ( 可使用衬
that may cause damage to the LCD and degrade its display result.
垫 ) ,以缓冲外力对液晶显示模块的损坏或因受力不均而
-
Avoid showing a display pattern on screen for a long time (continuous
产生的显示不匀等异常现象。
ON segment).
-
避免液晶显示屏在某一画面下长时间点亮,否则有出现
-
LCD module reliability may be reduced by temperature shock.
残影的风险;请通过软件每隔一段时间改变一次画面。
-
When storing and operating LCD module, avoids exposure to direct -
液晶显示模块的可靠性可能因温度冲击而降低。
sunlight, high humidity, high or low temperature. They may damage or -
请勿在阳光直射、高湿、高温或低温下储存和使用液晶
degrade the LCD module.
显示模块,这将造成液晶显示模块的损坏或失效。
-
Never
leave
LCD
module
in
extreme
condition
(max./min
storage/operate temperature) for more than 48hr.
-
请勿在极限环境 ( 最大 / 最小存储 / 工作温度 ) 下使用或放
-
Recommend LCD module storage conditions is 0 C~40 C <80%RH.
置液晶显示模块超过 48 小时以上。
-
LCD module should be stored in the room without acid, alkali and -
液晶显示模块建议存储条件为 : 0 C~40 C <80%RH 。
harmful gas.
-
请勿让液晶显示模块存储于带有 酸性 , 碱性 , 有害气体
-
Avoid dropping & violent shocking during transportation, and no
环境之中。
excessive pressure press, moisture and sunlight.
-
在运输过程中 , 请勿让液晶显示模块跌落与猛烈震动 ,
-
LCD module can be easily damaged by static electricity. Please
同时避免 异常挤压 , 高湿度 , 与阳光照射 .
maintain an optimum anti-static working environment to protect the -
液晶显示模块极易受静电损坏,请务必保证液晶显示模
LCD module. (eg. ground the soldering irons properly)
块在防静电的工作环境中使用或保存。 ( 如 : 烙铁正确接
-
Be sure to ground the body when handling LCD module.
地 , 等 )
-
Only hold LCD module by its sides. Never hold LCD module by -
拿取液晶显示模块时需注意操作人员的接地情况。
applying force on the heat seal or TAB.
-
请手持液晶显示模块的边沿取放模块,防止热压纸或 TAB
-
When soldering, control the temperature and duration avoid damaging
部位受力。
the backlight guide or diffuser which might degrade the display result -
焊接液晶模块时,请注意控制烙铁的温度、焊接时间,
such as uneven display.
以免烫坏导光板或偏光片,导致显示不匀等不良现象发
-
Never let LCD module contact with corrosive liquids, which might
生。
cause damage to the backlight guide or the electric circuit of LCD -
请勿使用洗板水等腐蚀性液体接触液晶模块,以免腐蚀
module.
导光板或模块电路。
-
Only clean LCD with a soft dry cloth, Isopropyl Alcohol or Ethyl
Alcohol. Other solvents (e.g. water) may damage the LCD.
-
仅可使用柔软的干布 , 异丙醇或乙醇清洁液晶屏表面,
-
Never add force to components of LCD module. It may cause invisible
其他任何溶剂 ( 如 : 水 ) 都有可能损坏液晶模块。
damage or degrade the module's reliability.
-
请勿挤压液晶显示模块上的元器件,以避免产生潜在的
-
When mounting LCD module, please make sure it is free from twisting,
损坏或失效而影响产品可靠性。
warping and bending.
-
装配液晶显示模块时,请务必注意避免液晶显示模块的
-
Do not add excessive force on surface of LCD, which may cause the
扭曲或变形。
display color change abnormally.
-
请勿挤压液晶显示屏表面,这将导致显示颜色的异常。
-
LCD panel is made with glass. Any mechanical shock (e.g. dropping -
液晶屏由玻璃制作而成,任何机械碰撞 ( 如从高处跌落 )
from high place) will damage the LCD module.
均有可能损坏液晶显示模块。
-
Protective film is attached on LCD screen. Be careful when peeling off -
液晶屏表面带有保护膜 , 揭除保护膜时需要注意可能产
this protective film, since static electricity may be generated.
生的静电。
-
Polarizer on LCD gets scratched easily. If possible, do not remove -
因液晶显示屏表面的偏光片极易划伤,安装完成之前请
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LCD protective film until the last step of installation.
尽量不要揭下保护膜。
-
When peeling off protective film from LCD, static charge may cause -
请缓慢揭除保护膜,在此过程中液晶显示屏上可能会产
abnormal display pattern. The symptom is normal, and it will turn back
生静电线,此为正常情况,可在短时间内消失。
to normal in a short while.
-
LCD panel has sharp edges, please handle with care.
-
请注意避免被液晶显示屏的边缘割伤。
-
Never attempt to disassemble or rework LCD module.
-
请不要试图拆卸或改造液晶显示模块。
-
If display panel is damaged and liquid crystal substance leaks out, be -
当液晶显示屏出现破裂 , 内部液晶液体可能流出 ; 相关
sure not to get any in your mouth, if the substance comes into contact
液体不可吞吃 , 绝对不可接触嘴巴 , 如接触到皮肤或衣
with your skin or clothes promptly wash it off using soap and water.
服 , 请使用肥皂与清水彻底清洗 .
7. CTP Mounting Instructions
7. 电容触摸屏安装指导
7.1 Bezel Mounting (Figure 1)
7.1 面框安装(附图 1 )
-
The bezel window should be bigger than the CTP active area. It should
-
客户面框窗口应大于 CTP 动作区域,各边离动作区应
be≥0.5mm each side.
≥ 0.5mm.
-
Gasket should be installed between the bezel and the CTP surface.
-
面框与 CTP 面板间应垫有胶垫,其最终间隙约为 0.5 ~
The final gap should be about 0.5~1.0mm.
1.0mm.
-
It is recommended to provide an additional support bracket for
-
建议必要时在背面提供附加支架 ( 例如无安装结构的薄型
backside support when necessary (e.g. slim type TFT module without
TFT 模块 ) ,应仅利用适当支撑以保持模块位置 .
mounding structure). They should only provide appropriate support
and keep the module in place.
-
The mounting structure should be strong enough to prevent external
-
安装结构应具有足够的强度,以防止外部不均匀力或扭
uneven force or twist act onto the module.
曲力作用到模块上 .
Figure 1
7.2 Surface Mounting (Figure 2)
7.2 嵌入安装(附图 2 )
-
As the CTP assembling on the countersink area with double side -
客户面框应具有使用双面胶粘贴 CTP 的结构沉台面,其
adhesive.
粘贴面要求平整且洁净无污以保证粘贴牢靠 .
The countersink area should be flat and clean to ensure the double
side adhesive installation result.
-
The Bezel is recommend to keep a gap (≥0.3mm each side) around -
考虑到制作误差,建议面框与 CTP 盖板之间四周留有
the cover lens for tolerance.
≥ 0.3mm 间隙 .
-
It is recommended to provide an additional support bracket with gasket -
建议必要时在背面提供垫有胶垫附加支架 ( 例如无安装结
for backside support when necessary (e.g.
TFT module without
构的 TFT 模块 ) ,应仅利用适当支撑以保持模块位置 .
mounding structure). They should only provide appropriate support
and keep the module in place.
-
安装结构应具有足够的强度,以防止外部不均匀力或扭
-
The mounting structure should be strong enough to prevent external
曲力作用到模块上。
uneven force or twist act onto the module
Figure 2
7.3 Additional Cover Lens Mounting (Figure 3)
7.3 覆加盖板(附图 3 )
-
For the case of additional cover Lens mounting, it is necessary to -
需要覆加玻璃盖板的安装,为确保其功能,有必要查看
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recheck with the CTP specification about the material and thickness to
产品规格书中有关盖板材料和厚度的说明 .
ensure the functionality.
-
It should keep a 0.2~0.3mm gap between the cover lens and the CTP -
玻璃盖板与 CTP 表面之间应留有 0.2 ~ 0.3mm 间隙 .
surface..
-
The cover lens window should be bigger than the active area of the -
玻璃盖板视窗应大于 CTP 动作区域,各边离动作区应
CTP.It should be≥0.5mm each side.
≥ 0.5mm 。
-
It is recommended to provide an additional support bracket for -
建议必要时在背面提供附加支架 ( 例如无安装结构的薄型
backside support when necessary (e.g. slim type TFT module without
TFT 模块 ) ,应仅利用适当支撑以保持模块位置 .
mounding structure). They should only provide appropriate support
and keep the module in place.
-
The mounting structure should be strong enough to prevent external -
安装结构应具有足够的强度,以防止外部不均匀力或扭
uneven force or twist act onto the module.
曲力作用到模块上 .
Figure 3
8. RTP Mounting Instructions
8. 电阻触摸屏安装指导
-
为避免面框直接压在动作区 (A.A.) 上造成误动作,面框与
-
It should bezel touching the RTP Active Area (A.A.) to prevent
电阻触摸屏 (RTP) 之间应留有一定的空隙 D=0.2~0.3mm 之
abnormal touch.It should left gab D=0.2~0.3mm in between. (Figure
间 .( 附图 4)
4)
-
Outer bezel design should take care about the area outside the A.A.
-
设计面框时,要注意用面框保护触摸屏四周的非保证操作
Those areas contain circuit wires which is having different thickness.
区域,因为布线区域在此处形成一台阶,在此区域附近
Touching those areas could de-form the ITO film. As a result bezel the
操作时 ITO Film 变形较大,容易导致 ITO 损坏而降低寿
ITO film be damaged and shorten its lifetime.
命。为保护 RTP 和避免误操作,在 RTP 与面框之间垫缓
It is suggested to protect those areas with gasket (between the bezel
冲物( Gasket ),我们建议设计面框应覆盖动作区的边
and RTP).The suggested figures are B≥0.50mm; C≥0.50mm . (Figure
缘,面框边缘到 V.A. 区的距离 B≥0.50mm; 垫圈内边缘
4)
到 V.A. 区的距离 C≥ 0.50mm. ( 附图 4)
-
The bezel side wall should keep space E= 0.2 ~ 0.3mm from the RTP. -
在设计面框与 RTP 组装时,应考虑到面框内侧与 RTP 外侧
(Figure 4)
的间距 E≥0.2mm. (附图 4)
Figure 4
-
In general design,
-
通常设计时:
RTP V.A. should be bigger than the TFT V.A.
RTP 的可视区 V.A. 应不小于 TFT 的可视区 V.A.
and RTP A.A. should be bigger than the TFT A.A.
及 RTP 的动作区 A.A. 应不小于 TFT 的动作区 A.A.
(Figure 5)
( 附图 5)
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Figure 5
Warranty
This product has been manufactured to our company’s specifications as a part for use in your company’s general
electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from
general electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power
control equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct
risk to human life and where extremely high levels of reliability are required. If the product is to be used in any of the
above applications, we will need to enter into a separate product liability agreement.
-
We cannot accept responsibility for any defect, which may arise form additional manufacturing of the product
(including disassembly and reassembly), after product delivery.
-
We cannot accept responsibility for any defect, which may arise after the application of strong external force to the
product.
-
We cannot accept responsibility for any defect, which may arise due to the application of static electricity after the
product has passed our company’s acceptance inspection pr ocedures.
-
When the product is in CCFL models, CCFL service life and brightness will vary according to the performance of the
inverter used, leaks, etc. We cannot accept responsibility for product performance, reliability, or defect, which may
arise.
-
We cannot accept responsibility for intellectual property of a third part, which may arise through the application of
our product to our assembly with exception to those issues relating directly to the structure or method of
manufacturing
of
our
product.
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