LMT035DNJFWD-1
LCD Module User Manual
Prepared by:
Checked by:
Approved by:
Huchubin
Date: 2020-09-16
Date:
Date:
Rev.
Descriptions
Release Date
0.1
Preliminary New release
2020-09-16
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Table of Content
1. Basic Specifications ................................................................................................................... 3
1.1 Block Diagram ................................................................................................................................................................ 3
1.2 Terminal Functions ......................................................................................................................................................... 4
2. Absolute Maximum Ratings ...................................................................................................... 5
3. Electrical Characteristics .......................................................................................................... 5
3.1 DC Characteristics ......................................................................................................................................................... 5
3.2 LED Backlight Circuit Characteristics ............................................................................................................................. 6
4. AC Characteristics ..................................................................................................................... 6
4.1 DBI Type B ..................................................................................................................................................................... 6
4.2 3-Line SPI Interface Timing Characteristic ................................................................................................................... 11
4.3 4-Line SPI Interface Timing Characteristic ................................................................................................................... 12
4.4 DPI Interface ................................................................................................................................................................ 13
4.5 Power ON/OFF Sequence............................................................................................................................................ 16
4.6 Reset timing ................................................................................................................................................................. 17
5 . Optical Characteristics ............................................................................................................ 18
6. LCD Module Design and Handling Precautions .............................................................................................................. 21
7. CTP Mounting Instructions .............................................................................................................................................. 22
8. RTP Mounting Instructions .............................................................................................................................................. 23
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1. Basic Specifications
Screen Size(Diagonal) :
3.5”
Color Depth:
65K/262K Color
Number of dots :
320(RGB)x480
Active Area :
48.96x73.44mm
Dot Pitch :
0.153x0.153mm
Display Technology :
a-Si TFT active matrix
Display Mode :
Transmissive With Normally white
Pixel Configuration :
RGB Vertical Stripe
Viewing Direction :
12H (*1) (gray scale inverse)
6H (*2)
Polarizer Surface Treatment:
HC
Backlight Type:
LEDs
Outline Dimension :
55.26x 84.69 x 2.2 mm
(exclude FPC , see dwg for details)
Operating Temperature :
-20 ~ +70°C (No Condensation)
Storage Temperature :
-30 ~ +80°C (No Condensation)
Note:
*1. For saturated color display content (eg. pure-red, pure-green, pure-blue or pure-colors-combinations).
*2. For “color scales” display content.
*3. Color tone may slightly change by temperature and driving condition.
1.1 Block Diagram
LEDA, LEDK1
Backlight Circuit
320(RGB) x480pixels
TFT Panel
VDD, IOVDD
VSS
IM0~IM2,RESX,VSYNC,HSYNC,PCLK,DE,DOUT,SDA
ILI9488 or equivalent
RDX,WRX_SCL,DCX,CSX
DB17/R5,Msb, DB16/R4~DB13/R1, DB12/R0,Lsb,
DB11/G5,Msb, DB10/G4~DB7/G1, DB6/G0,Lsb ,
DB5/B5,Msb, DB4/B4~DB1/B1, DB0/B0,Lsb
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1.2 Terminal Functions
Pin
No.
PIN Name
I/O
Descriptions
1
VSS
Power
Negative power supply,0V
2,3
IOVDD
Power
IO Positive Power
4,5
VDD
Power
Positive power supply
6
IM0
Input
MPU system interface mode select
7
IM1
Input
MPU system interface mode select
8
IM2
Input
MPU system interface mode select
Reset signal
9
RESX
Input
RESX = L, Initialization is executed
RESX = H, Normal running.
10
VSYNC
Input
Vertical sync. signal in RGB mode
If no used, please connect this pin to VSS
11
HSYNC
Input
Horizontal sync, signal in RGB mode
If no used, please connect this pin to VSS
12
PCLK
Input
Pixel clock signal in RGB mode
If no used, please connect this pin to VSS
13
DE
Output
Data enable signal in RGB mode
If no used, please fix this pin at VSS level
14
DB17/R5,Msb
I/O
15
DB16/R4
I/O
:
:
:
18
DB13/R1
I/O
19
DB12/R0,Lsb
I/O
20
DB11/G5,Msb
I/O
21
DB10/G4
I/O
:
:
:
Data Bus
24
DB7/G1
I/O
25
DB6/G0,Lsb
I/O
26
DB5/B5,Msb
I/O
27
DB4/B4
I/O
:
:
:
30
DB1/B1
I/O
31
DB0/B0,Lsb
I/O
32
VSS
Power
Negative power supply,0V
33
DOUT
Output
Serial data output pin
If no used, leave this pin open
34
SDA
I/O
serial data input /output bi-direction pin
35
RDX
Input
serve as a read signal
36
Input
(WR) Write data enable pin in DBI Type B
WRX_SCL
(SCL) Write data enable pin in DBI Type C
If no used, please connect this pin to IOVDD
37
Input
Data/Command Selection pin
DCX
Low: Command
High: Parameter
38
CSX
Input
Chip select signal
If no used, please connect this pin to IOVDD
39
NC(XR)
40
NC(YD)
-
No connect
41
NC(XL)
42
NC(YU)
43
LEDA
Power
LED ANODE
44~49
LEDK
Power
LEDK CATHODE
50
VSS
Power
Negative power supply,0V
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2. Absolute Maximum Ratings
Items
Symbol
Min.
Max.
Unit
Condition
Power Voltage
VDD
-0.3
+3.3
V
V SS = 0V
Input Voltage
V IN
-0.3
+3.3
V
V SS = 0V
Operating Temperature
T OP
-20
+70
° C
No Condensation
Storage Temperature
T ST
-30
+80
° C
No Condensation
Cautions:
Any Stresses exceeding the Absolute Maximum Ratings may cause substantial damage to the device. Functional
operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure
to extreme conditions may affect device reliability.
3. Electrical Characteristics
3.1 DC Characteristics
V SS =0V, T OP =25 ° C
Items
Symbo
MIN.
TYP.
MAX.
Unit Condition /
l
Application Pin
Operating Voltage
VDD
2.65
3.0
3.3
V
VDD,IOVDD
Input High Voltage
V IH
0.7xV DD
-
V DD
V
IM0~IM2,RESX,VSYNC,HSY
NC,PCLK,DB17/R5,Msb,
DB16/R4~DB13/R1
,DB12/R0,Lsb,DB11/G5,Msb,
Input Low Voltage
V IL
-0.3
-
0.3xV DD
V
DB10/G4~DB7/G1
,DB6/G0,Lsb,DB5/B5,Msb,
DB4/B4~DB1/B1,DB0/B0,Lsb,
SDA,RDX,WRX_SCL,DCX,
CSX,
Output Low Voltage
V OL
0
-
0.99
V
DB17/R5,Msb,
DB16/R4~DB13/R1
,DB12/R0,Lsb,DB11/G5,Msb,
DB10/G4~DB7/G1
,DB6/G0,Lsb,DB5/B5,Msb,
DB4/B4~DB1/B1,DB0/B0,Lsb,
DE,SDA,DOUT
Operating Current
I DD
-
8
-
mA
VDD (*1)
Note: *1. VDD=3.0V
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3.2 LED Backlight Circuit Characteristics
LEDK(1~6)=0V, I LEDA =120mA, T OP =25 ° C
Items
Symbol
MIN.
TYP.
MAX.
Unit
Applicable Pin
Forward Voltage
LEDA
-
3.2
-
V
LEDA
Forward Current
I LEDA
-
120
-
mA
LEDA
Cautions:
Exceeding the recommended driving current could cause substantial damage to the backlight and shorten its lifetime.
LEDA
LEDK1
:
LEDK6
No.of LEDs = 6pcs
4. AC Characteristics
4.1 DBI Type B
4.1.1 DBI Type B Timing Characteristic
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Please refer to IC: ILI9488 data sheet for more details.
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4.1.2 DBI Type B Data Bus
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Please refer to IC:
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ILI9488 data sheet for more details.
4.2 3-Line SPI Interface Timing Characteristic
Please refer to IC: ILI9488 data sheet for more details.
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4.3 4-Line SPI Interface Timing Characteristic
Note:Ta=-30 to 70 ℃， IOVDD ， VDD=2.5V to 3.3V ， VSS=0V ， T=10+/-0.5ns.
Please refer to IC: ILI9488 data sheet for more details.
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4.4 DPI Interface
4.4.1 DPI Interface Characteristic
Please refer to IC: ILI9488 data sheet for more details.
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4.4.2 DPI Interface pixel format
The Pixel clock (DCLK) runs all the time without stop. It is used to enter VS, HS, DE and D[17: 0] states
when there is a rising edge of the DCLK. The DCLK cannot be used as the internal clock for other functions of
the display module.
Vertical synchronization (VS) is used to indicate when a new frame of the display is received. This is low
enable and its state is read to the display module by a rising edge of the DCLK signal.
Horizontal synchronization (HS) IS used to indicate when a new line of the frame is received. This is low
enable and its state is read to the display module by a rising edge of the DCLK signal.
Data Enable (DE) is used to indicate when the RGB information that should be transferred in the display is
received. This is a high enable, and its state is read to the display module by a rising edge of the DCLK signal.
D[17:0] is used to indicate what is the information of the image that is transferred on the display (when DE = 0
(low) and there is a rising edge of DCLK). D[17:0] can be 0(low) or 1(high). These lines are read by a rising
edge of the DCLK signal. In RGB interface modes, the input display data is written to GRAM first then outputs
the corresponding source voltage according to the gray data from GRAM.
Note ： Please refer to IC: ILI9488 data sheet for more details.
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4.4.3 DPI(RGB) Interface timing
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4.5 Power ON/OFF Sequence
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IOVDD and VDD can be applied or powered down in any order. During the Power Off sequence ,if the LCD is
in the Sleep In mode, VDD and IOVDD must be powered down with a minimum of 120 msec.If the LCD is in
the Sleep In mode, VDD and IOVDD can be powered down with a minimum of 0msec after the /RST has
been released. /CS can be applied at any time or can be permanently grounded. /RST has priority over /CS.
Notes:
1.
There will be no damage to the ILI9488 if the power sequences are not met.
2.
There will be no abnormal visible effects on the display panel during the Power On/Off Sequence.
3.
There will be no abnormal visible effects on the display between the end of the Power On Sequence and before receiving the Sleep
Out command, and also between receiving the Sleep In command and the Power Off Sequence.
4.
If the /RST line is not steadily held by the host during the Power On Sequence as defined in Sections 11.1 and 11.2 ( ILI9488
datasheet ), then it will be necessary to apply the Hardware /RST after the completion of the Host Power On Sequence to ensure
correct operations. Otherwise, all the functions are not guaranteed.
5.
When the power is turned on, the climb period timing (Trise) must be greater than 10us.
6.
Keep data pins D[17:0] at low level, or IOVDD comes later
Note ： Please refer to IC: ILI9488 data sheet for more details.
4.6 Reset timing
Item
Symbol
MIN.
TYP.
MAX.
Unit
Reset LOW pulse width
t RW
1.0
-
-
us
Reset time
T RT
-
-
120
ms
Please refer to IC: ILI9488 data sheet for more details.
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5 . Optical Characteristics
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6. LCD Module Design and Handling Precautions
6. 液晶显示模块设计和使用须知
-
Please ensure V0, VCOM is adjustable, to enable LCD module get the best -
请注意 V0, VCOM 的设定 , 以确保液晶显示模块
contrast ratio under different temperatures, view angles and positions.
在不同的使用温度下以及在不同的视角和位置观
察模块显示，均能达到最佳对比度，请务必将应
-
Normally display quality should be judged under the best contrast ratio within
用电路上设置为对比度可调。
viewable area. Unexpected display pattern may com out under abnormal -
请注意液晶显示模块的显示品质判定是指在正常
contrast ratio.
对比度下以及视窗 (V.A) 范围内进行的，非正常对
-
Never operate the LCD module exceed the absolute maximum ratings.
比度下液晶可能会出现非预期的显示不良，应注
-
Never apply signal to the LCD module without power supply.
意区分。
-
请勿在最大额定值以外使用液晶显示模块。
-
Keep signal line as short as possible to reduce external noise interference.
-
IC chip (e.g. TAB or COG) is sensitive to light. Strong light might cause -
请勿在没有接通电源的条件下，给液晶显示模块
malfunction. Light sealing structure casing is recommended.
输送信号。
-
请尽可能缩短信号线的连接，以避免对液晶显示
-
Make sure there is enough space (with cushion) between case and LCD panel,
模块的信号干扰。
to prevent external force passed on to the panel; otherwise that may cause -
集成电路因 IC 芯片 ( 如 TAB 或 COG) 对紫外线极为
damage to the LCD and degrade its display result.
敏感，强光环境下可能会引起液晶显示模块功能
-
Avoid showing a display pattern on screen for a long time (continuous ON
失效，故应采用不透光的外壳。
segment).
-
请在液晶显示模块与外壳之间保留足够的空间 ( 可
使用衬垫 ) ，以缓冲外力对液晶显示模块的损坏或
-
LCD module reliability may be reduced by temperature shock.
因受力不均而产生的显示不匀等异常现象。
-
When storing and operating LCD module, avoids exposure to direct sunlight,
high humidity, high or low temperature. They may damage or degrade the LCD -
避免液晶显示屏在某一画面下长时间点亮，否则
module.
有出现残影的风险；请通过软件每隔一段时间改
-
Never leave LCD module in extreme condition (max./min storage/operate
变一次画面。
temperature) for more than 48hr.
-
液晶显示模块的可靠性可能因温度冲击而降低。
-
Recommend LCD module storage conditions is 0 C~40 C <80%RH.
-
请勿在阳光直射、高湿、高温或低温下储存和使
-
LCD module should be stored in the room without acid, alkali and harmful gas.
用液晶显示模块，这将造成液晶显示模块的损坏
-
Avoid dropping & violent shocking during transportation, and no excessive
或失效。
pressure press, moisture and sunlight.
-
LCD module can be easily damaged by static electricity. Please maintain an -
请勿在极限环境 ( 最大 / 最小存储 / 工作温度 ) 下使
optimum anti-static working environment to protect the LCD module. (eg. ground
用或放置液晶显示模块超过 48 小时以上。
the soldering irons properly)
-
液 晶 显 示 模 块 建 议 存 储 条 件 为 : 0 C~40 C
-
Be sure to ground the body when handling LCD module.
<80%RH 。
-
Only hold LCD module by its sides. Never hold LCD module by applying force -
请勿让液晶显示模块存储于带有 酸性 , 碱性 , 有
on the heat seal or TAB.
害气体环境之中。
-
When soldering, control the temperature and duration avoid damaging the -
在运输过程中 , 请勿让液晶显示模块跌落与猛烈
backlight guide or diffuser which might degrade the display result such as
震动 , 同时避免 异常挤压 , 高湿度 , 与阳光照
uneven display.
射 .
-
Never let LCD module contact with corrosive liquids, which might cause damage -
液晶显示模块极易受静电损坏，请务必保证液晶
to the backlight guide or the electric circuit of LCD module.
显示模块在防静电的工作环境中使用或保存。
-
Only clean LCD with a soft dry cloth, Isopropyl Alcohol or Ethyl Alcohol. Other
( 如 : 烙铁正确接地 , 等 )
solvents (e.g. water) may damage the LCD.
-
拿取液晶显示模块时需注意操作人员的接地情
-
Never add force to components of LCD module. It may cause invisible damage
况。
or degrade the module's reliability.
-
请手持液晶显示模块的边沿取放模块，防止热压
-
When mounting LCD module, please make sure it is free from twisting, warping
纸或 TAB 部位受力。
and bending.
-
焊接液晶模块时，请注意控制烙铁的温度、焊接
-
Do not add excessive force on surface of LCD, which may cause the display
时间，以免烫坏导光板或偏光片，导致显示不匀
color change abnormally.
等不良现象发生。
-
LCD panel is made with glass. Any mechanical shock (e.g. dropping from high -
请勿使用洗板水等腐蚀性液体接触液晶模块，以
place) will damage the LCD module.
免腐蚀导光板或模块电路。
-
仅可使用柔软的干布 , 异丙醇或乙醇清洁液晶屏
表面，其他任何溶剂 ( 如 : 水 ) 都有可能损坏液晶模
块。
-
请勿挤压液晶显示模块上的元器件，以避免产生
潜在的损坏或失效而影响产品可靠性。
-
装配液晶显示模块时，请务必注意避免液晶显示
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模块的扭曲或变形。
-
请勿挤压液晶显示屏表面，这将导致显示颜色的
异常。
-
液晶屏由玻璃制作而成，任何机械碰撞 ( 如从高处
跌落 ) 均有可能损坏液晶显示模块。
-
Protective film is attached on LCD screen. Be careful when peeling off this -
液晶屏表面带有保护膜 , 揭除保护膜时需要注意
protective film, since static electricity may be generated.
可能产生的静电。
-
Polarizer on LCD gets scratched easily. If possible, do not remove LCD -
因液晶显示屏表面的偏光片极易划伤，安装完成
protective film until the last step of installation.
之前请尽量不要揭下保护膜。
-
When peeling off protective film from LCD, static charge may cause abnormal -
请缓慢揭除保护膜，在此过程中液晶显示屏上可
display pattern. The symptom is normal, and it will turn back to normal in a short
能会产生静电线，此为正常情况，可在短时间内
while.
消失。
-
LCD panel has sharp edges, please handle with care.
-
Never attempt to disassemble or rework LCD module.
-
请注意避免被液晶显示屏的边缘割伤。
-
If display panel is damaged and liquid crystal substance leaks out, be sure not -
请不要试图拆卸或改造液晶显示模块。
to get any in your mouth, if the substance comes into contact with your skin or -
当液晶显示屏出现破裂 , 内部液晶液体可能流出 ;
clothes promptly wash it off using soap and water.
相关液体不可吞吃 , 绝对不可接触嘴巴 , 如接触
到皮肤或衣服 , 请使用肥皂与清水彻底清洗 .
7. CTP Mounting Instructions
7.1 Bezel Mounting (Figure 1)
-
The bezel window should be bigger than the CTP active area. It should 7. 电容触摸屏安装指导
be ≥0.5mm each side.
7.1 面框安装（附图 1 ）
-
Gasket should be installed between the bezel and the CTP surface. -
客户面框窗口应大于 CTP 动作区域，各边离动作
The final gap should be about 0.5~1.0mm.
区应≥ 0.5mm.
-
It is recommended to provide an additional support bracket for backside support -
面框与 CTP 面板间应垫有胶垫，其最终间隙约为
when necessary (e.g. slim type TFT module without mounding structure). They
0.5 ～ 1.0mm.
should only provide appropriate support and keep the module in place.
-
建议必要时在背面提供附加支架 ( 例如无安装结构
-
The mounting structure should be strong enough to prevent external uneven
的薄型 TFT 模块 ) ，应仅利用适当支撑以保持模块
force or twist act onto the module.
位置 .
-
安装结构应具有足够的强度，以防止外部不均匀
力或扭曲力作用到模块上 .
Figure 1
7.2 Surface Mounting (Figure 2)
7.2 嵌入安装（附图 2 ）
-
As the CTP assembling on the countersink area with double side adhesive. -
客户面框应具有使用双面胶粘贴 CTP 的结构沉台
The countersink area should be flat and clean to ensure the double side
面，其粘贴面要求平整且洁净无污以保证粘贴牢
adhesive installation result.
靠 .
-
The Bezel is recommend to keep a gap ( ≥0.3mm each side) around the cover
lens for tolerance.
-
It is recommended to provide an additional support bracket with gasket for -
考虑到制作误差，建议面框与 CTP 盖板之间四周
backside support when necessary (e.g.
TFT module without mounding
留有≥ 0.3mm 间隙 .
structure). They should only provide appropriate support and keep the module in -
建议必要时在背面提供垫有胶垫附加支架 ( 例如无
place.
安装结构的 TFT 模块 ) ，应仅利用适当支撑以保持
-
The mounting structure should be strong enough to prevent external uneven
模块位置 .
force or twist act onto the module
-
安装结构应具有足够的强度，以防止外部不均匀
力或扭曲力作用到模块上。
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Figure 2
7.3 Additional Cover Lens Mounting (Figure 3)
7.3 覆加盖板（附图 3 ）
-
For the case of additional cover Lens mounting, it is necessary to recheck with -
需要覆加玻璃盖板的安装，为确保其功能，有必
the CTP specification about the material and thickness to ensure the
要查看产品规格书中有关盖板材料和厚度的说明 .
functionality.
-
It should keep a 0.2~0.3mm gap between the cover lens and the CTP surface.. -
玻璃盖板与 CTP 表面之间应留有 0.2 ～ 0.3mm 间
-
The cover lens window should be bigger than the active area of the CTP.It
隙 .
should be ≥0.5mm each side.
-
It is recommended to provide an additional support bracket for backside support -
玻璃盖板视窗应大于 CTP 动作区域，各边离动作
when necessary (e.g. slim type TFT module without mounding structure). They
区应≥ 0.5mm 。
should only provide appropriate support and keep the module in place.
-
建议必要时在背面提供附加支架 ( 例如无安装结构
-
The mounting structure should be strong enough to prevent external uneven
的薄型 TFT 模块 ) ，应仅利用适当支撑以保持模块
force or twist act onto the module.
位置 .
-
安装结构应具有足够的强度，以防止外部不均匀
力或扭曲力作用到模块上 .
Figure 3
8. RTP Mounting Instructions
8. 电阻触摸屏安装指导
-
It should bezel touching the RTP Active Area (A.A.) to prevent abnormal touch.It -
为避免面框直接压在动作区 (A.A.) 上造成误动
should left gab D=0.2~0.3mm in between. (Figure 4)
作，面框与电阻触摸屏 (RTP) 之间应留有一定的空
隙 D=0.2~0.3mm 之间 .( 附图 4)
-
Outer bezel design should take care about the area outside the A.A. Those
-
设计面框时，要注意用面框保护触摸屏四周的非
areas contain circuit wires which is having different thickness. Touching those
保证操作区域，因为布线区域在此处形成一台
areas could de-form the ITO film. As a result bezel the ITO film be damaged and
阶，在此区域附近操作时 ITO Film 变形较大，容
shorten its lifetime.
易导致 ITO 损坏而降低寿命。为保护 RTP 和避免
It is suggested to protect those areas with gasket (between the bezel and
误操作，在 RTP 与面框之间垫缓冲物
RTP).The suggested figures are B ≥0.50mm; C≥0.50mm. (Figure 4)
（ Gasket ），我们建议设计面框应覆盖动作区的
边缘，面框边缘到 V.A. 区的距离 B≥0.50mm; 垫
圈内边缘到 V.A. 区的距离 C≥0.50mm. (附图 4)
-
The bezel side wall should keep space E= 0.2 ~ 0.3mm from the RTP. (Figure
-
在设计面框与 RTP 组装时，应考虑到面框内侧与
4)
RTP 外侧的间距 E≥0.2mm. (附图 4)
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Figure 4
-
In general design,
-
通常设计时：
RTP V.A. should be bigger than the TFT V.A.
RTP 的可视区 V.A. 应不小于 TFT 的可视区 V.A.
and RTP A.A. should be bigger than the TFT A.A.
及 RTP 的动作区 A.A. 应不小于 TFT 的动作区
(Figure 5)
A.A.
( 附图 5)
Figure 5
Warranty
This product has been manufactured to our company’s specifications as a part for use in your company’s general
electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from
general electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power
control equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct
risk to human life and where extremely high levels of reliability are required. If the product is to be used in any of the
above applications, we will need to enter into a separate product liability agreement.
-
We cannot accept responsibility for any defect, which may arise form additional manufacturing of the product
(including disassembly and reassembly), after product delivery.
-
We cannot accept responsibility for any defect, which may arise after the application of strong external force to the
product.
-
We cannot accept responsibility for any defect, which may arise due to the application of static electricity after the
product has passed our company’s acceptance inspection procedures.
-
When the product is in CCFL models, CCFL service life and brightness will vary according to the performance of the
inverter used, leaks, etc. We cannot accept responsibility for product performance, reliability, or defect, which may
arise.
-
We cannot accept responsibility for intellectual property of a third part, which may arise through the application of
our product to our assembly with exception to those issues relating directly to the structure or method of
manufacturing of our product.
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