LMT035DNJFWD-NND
LCD Module User Manual
Prepared by:
Checked by:
Approved by:
Caiwei
Date: 2024-04-30
Date:
Date:
Rev. Descriptions
Edit
Release Date
0.1 Preliminary New release
Gong huimei
2024-01-03
0.2
Updata Outline 、 2.2 CTP IIC address 、 3.Relative Humidity and
Caiwei
2024-04-30
Ambient Humidity
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Table of Content
1. General Specifications.................................................................................................................. 3
1.1 Block Diagram..................................................................................................................................................................3
2. Terminal Functions........................................................................................................................4
2.1 TFT Interface Terminal....................................................................................................................................................4
2.2 CTP Interface Terminal................................................................................................................................................... 5
3. Absolute Maximum Ratings..........................................................................................................5
4. Electrical Characteristics..............................................................................................................6
4.1 DC Characteristics of TFT LCD Panel............................................................................................................................ 6
4.2 DC Characteristics of CTP.............................................................................................................................................. 6
4.3 LED Backlight Circuit Characteristics..............................................................................................................................6
5. AC Characteristics......................................................................................................................... 7
5.1 DBI Type B...................................................................................................................................................................... 7
5.2 3-Line SPI Interface Timing Characteristic....................................................................................................................13
5.3 4-Line SPI Interface Timing Characteristic....................................................................................................................14
5.4 DPI Interface................................................................................................................................................................. 15
5.5 Power ON/OFF Sequence............................................................................................................................................ 19
5.6 Reset timing.................................................................................................................................................................. 20
6 . Optical Characteristics................................................................................................................20
7 . LCD Module Design and Handling Precautions.......................................................................23
8 . CTP Mounting Instructions.........................................................................................................24
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1. General Specifications
Screen Size(Diagonal) :
3.5”
Active Area :
48.96x73.44mm
Number of dots :
320(RGB)x480
Pixel Pitch :
0.153x0.153mm
Color Depth:
262k Colors
Display Technology :
a-Si TFT active matrix
Display Mode :
Normally White,Transmissive
Display Interface :
MCU/RGB+SPI
Viewing Direction :
12H (*1) (gray scale inverse)
6H (*2)
Touch Panel :
Capacitive Touch Panel
Surface Treatment:
Glare
Touch Interface:
IIC Touch Interface
Storage Temperature :
-30 ~ +80°C
Operating Temperature :
-20 ~ +70°C
Note:
*1. For saturated color display content (eg. pure-red, pure-green, pure-blue or pure-colors-combinations).
*2. For “color scales” display content.
*3. Color tone may slightly change by temperature and driving condition.
1.1 Block Diagram
VDD
VSS
Capacitive Touch Panel
RST,INT,SDA,SCL
LEDA, LEDK
Backlight Circuit
320(RGB) x480pixels
TFT Panel
VDD, IOVDD
VSS
IM0~IM2,RESX,VSYNC,HSYNC,PCLK,DE,DOUT,SDA
RDX,WRX_SCL,DCX,CSX
ILI9488 or equivalent
DB17/R5,Msb, DB16/R4~DB13/R1, DB12/R0,Lsb,
DB11/G5,Msb, DB10/G4~DB7/G1, DB6/G0,Lsb ,
DB5/B5,Msb, DB4/B4~DB1/B1, DB0/B0,Lsb
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2. Terminal Functions
2.1 TFT Interface Terminal
Pin No.
PIN Name
I/O
Descriptions
1
VSS
P
Negative power supply,0V
2,3
IOVDD
P
I/O Positive Power
4,5
VDD
P
Positive power supply
6
IM0
I
MPU system interface mode select
7
IM1
I
MPU system interface mode select
8
IM2
I
MPU system interface mode select
Reset signal
9
RESX
I
RESX = L, Initialization is executed
RESX = H, Normal running
10
VSYNC
I
Vertical sync, signal in RGB mode
If no used, please connect this pin to VSS
11
HSYNC
I
Horizontal sync, signal in RGB mode
If no used, please connect this pin to VSS
12
PCLK
I
Pixel clock signal in RGB mode
If no used, please connect this pin to VSS
13
DE
O
Data enable signal in RGB mode
If no used, please connect this pin to VSS
14
DB17/R5,Msb
I/O
15
DB16/R4
I/O
:
:
:
18
DB13/R1
I/O
19
DB12/R0,Lsb
I/O
20
DB11/G5,Msb
I/O
21
DB10/G4
I/O
:
:
:
Data Bus
24
DB7/G1
I/O
25
DB6/G0,Lsb
I/O
26
DB5/B5,Msb
I/O
27
DB4/B4
I/O
:
:
:
30
DB1/B1
I/O
31
DB0/B0,Lsb
I/O
32
VSS
P
Negative power supply,0V
33
DOUT
O
Serial data output pin
If no used, leave this pin open
34
SDA
I/O
Serial data input /output bi-direction pin
If no used, please connect this pin to VSS
35
RDX
I
Serve as a read signal
If no used, please connect this pin to IOVDD
(WR) Write data enable pin in DBI Type B
36
WRX_SCL
I
(SCL) Write data enable pin in DBI Type C
If no used, please connect this pin to IOVDD
Data/Command Selection pin
37
DCX
I
Low: Command
High: Parameter
If no used, please connect this pin to IOVDD
38
CSX
I
Chip select signal
If no used, please connect this pin to IOVDD
39
NC(XR)
40
NC(YD)
No connect
41
NC(XL)
-
42
NC(YU)
43
LEDA
P
LED ANODE
44~49
LEDK
P
LED CATHODE
50
VSS
P
Negative power supply,0V
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Note1:I--Input ， O--Output ， P--Power/Ground,VDD=VDD
Note2:If use the RGB interface,need to initialize the interface with 3/4-Line SPI before using RGB to
transfer data
2.2 CTP Interface Terminal
Pin No.
PIN Name
I/O
Descriptions
1
RST
I
Reset Pin
2
VDD
P
Voltage power
3
GND
P
Ground
4
INT
O
External interrupt to the host
5
SDA
I/O
IIC data input and output
6
SCL
I
IIC clock input
Note:
*1.The capacitance touch drive IC is GT911,Please refer to IC: GT911 data sheet for more details.
*2.IIC address=0X14.
3. Absolute Maximum Ratings
Items
Symbol
Min.
Max.
Unit
Condition
Power Voltage
VDD
-0.3
+3.3
V
V SS = 0V
Input Voltage
V IN
-0.3
+3.3
V
V SS = 0V
Operating Temperature
T OP
-20
+70
C
No Condensation
Storage Temperature
T ST
-30
+80
C
No Condensation
-
≤ 95
Ta ≤ 40˚C
-
≤ 85
40˚C< Ta ≤ 50˚C
Relative Humidity(*1)
RH
-
≤ 55
50˚C< Ta ≤ 60˚C
-
≤ 36
60˚C< Ta ≤ 70˚C
-
≤ 24
70˚C< Ta ≤ 80˚C
Ambient Humidity
AH
-
≤ 70
g/m 3
Ta>70˚C
Cautions:
*1.Ta means the ambient temperature.
It is necessary to limit the relative humidity to the specified temperature range. Condensation on the module is
not allowed.
*2.Any Stresses exceeding the Absolute Maximum Ratings may cause substantial damage to the device.
Functional operation of this device at other conditions beyond those listed in the specification is not implied
and prolonged exposure to extreme conditions may affect device reliability.
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4. Electrical Characteristics
4.1 DC Characteristics of TFT LCD Panel
V SS =0V, T OP =25 C
Items
Symbol
MIN.
TYP.
MAX.
Unit
Condition /
Application Pin
Operating Voltage
VDD
2.5
2.8
3.3
V
VDD,IOVDD
Input
High Level
V IH
0.7xV DD
-
V DD
V
IM0~IM2,RESX,VSYNC,HSYNC,
Signal
PCLK,DB17~DB0,SDA,RDX,
Voltage Low Level
V IL
-0.3
-
0.3xV DD
V
WRX_SCL,DCX,CSX
Output
High Level
V OH
0.8xV DD
V DD
V
Low
DB17~DB0,DE,SDA,DOUT
Voltage Low Level
V OL
0
-
0.2xV DD
V
Operating Current
I DD
-
12
-
mA VDD (*1)
Note: *1. VDD=2.8V
4.2 DC Characteristics of CTP
Items
Symbol
MIN.
TYP. MAX. Unit
Condition /
Application Pin
Operating Voltage
VDD
2.8
-
3.3
V
VDD,IOVDD
Operating Current
I DD
-
8
14.5
mA VDD active current
4.3 LED Backlight Circuit Characteristics
T OP =25 C
Items
Symbol
MIN.
TYP.
MAX.
Unit
Remark
Forward Voltage
Vf
2.7
3.2
3.4
V
For each LED
Forward Current
If
-
120
-
mA
For total LED
LED lifetime
-
-
30000
-
Hours
If=120mA/Vf=3.2V (TYP)
Note1: The LED driving condition is defined for each LED module (1LED Serial, 6LED Parallel).
Note2: Under LCM operating, the stable forward current should be inputted. And forward voltage is
for reference only.
Note3: Optical performance should be evaluated at Ta=25 ℃ only If LED is driven by high current,
high ambient temperature & humidity condition. The life time of LED will be reduced. Operating
life means brightness goes down to 50% initial brightness. Typical operating life time is estimated
data.At the same time the luminance of Backlight would decrease under the hight temperature.
Note4: The LED driving condition is defined for each LED module.
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5. AC Characteristics
5.1 DBI Type B
5.1.1 DBI Type B Timing Characteristic
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Please refer to IC: ILI9488 data sheet for more details.
5.1.2 DBI Type B Data Bus
Notes:
1. The data order is as follows: MSB = DB7, LSB =DB0, and picture data is MSB = Bit 5, LSB= Bit
0 for Green data, and MSB = Bit 4, LSB = Bit 0 for Red and Blue data.
2. 2-times transfer is used to transmit 1 pixel data to the 16-bit color depth information.
3.'-'= void
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Notes:
1. The data order is as follows: MSB = DB7, LSB =DB0, and picture data is MSB = Bit 5, LSB= Bit 0
for Green data, and MSB = Bit 4, LSB = Bit 0 for Red and Blue data.
2. 3-times transfer is used to transmit 1 pixel data to the 18-bit color depth information.
3.'-'= void
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Notes:
1. The data order is as follows: MSB = DB8, LSB =DB0, and picture data is MSB = Bit 5, LSB= Bit 0
for Green, Red and Blue data.
2. 2-times transfer is used to transmit 1 pixel data to the 18-bit color depth information.
3.'-'= void
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Notes:
1. The data order is as follows: MSB = DB15, LSB =DB0, and picture data is MSB = Bit 5, LSB=
Bit0 for Green data, and MSB = Bit4, LSB =Bit0 for Red and Blue data.
2. 1-times transfer is used to transmit 1 pixel data to the 16-bit color depth information.
3.'-'= void
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Notes:
1. The data order is as follows: MSB = DB17, LSB =DB0, and picture data is MSB = Bit 5, LSB=
Bit0 for Green , Red and Blue data.
2. 1-times transfer is used to transmit 1 pixel data to the 18-bit color depth information.
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5.2 3-Line SPI Interface Timing Characteristic
Please refer to IC: ILI9488 data sheet for more details.
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5.3 4-Line SPI Interface Timing Characteristic
Note1:Ta=-30 to 70 ℃ ， IOVDD ， VDD=2.5V to 3.3V ， VSS=0V ， T=10+/-0.5ns.
Note2:Does not include signal rising and falling times.
Please refer to IC: ILI9488 data sheet for more details.
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5.4 DPI Interface
5.4.1 DPI Interface Characteristic
Please refer to IC: ILI9488 data sheet for more details.
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5.4.2 DPI Interface pixel format
The Pixel clock (DCLK) runs all the time without stop. It is used to enter VS, HS, DE and D[17: 0] states
when there is a rising edge of the DCLK. The DCLK cannot be used as the internal clock for other functions of
the display module.
Vertical synchronization (VS) is used to indicate when a new frame of the display is received. This is low
enable and its state is read to the display module by a rising edge of the DCLK signal.
Horizontal synchronization (HS) IS used to indicate when a new line of the frame is received. This is low
enable and its state is read to the display module by a rising edge of the DCLK signal.
Data Enable (DE) is used to indicate when the RGB information that should be transferred in the display is
received. This is a high enable, and its state is read to the display module by a rising edge of the DCLK signal.
D[17:0] is used to indicate what is the information of the image that is transferred on the display (when DE = 0
(low) and there is a rising edge of DCLK). D[17:0] can be 0(low) or 1(high). These lines are read by a rising
edge of the DCLK signal. In RGB interface modes, the input display data is written to GRAM first then outputs
the corresponding source voltage according to the gray data from GRAM.
Note ： Please refer to IC: ILI9488 data sheet for more details.
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5.4.3 DPI(RGB) Interface timing
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5.5 Power ON/OFF Sequence
IOVDD and VDD can be applied or powered down in any order. During the Power Off sequence ,if the LCD is
in the Sleep In mode, VDD and IOVDD must be powered down with a minimum of 120 msec.If the LCD is in
the Sleep In mode, VDD and IOVDD can be powered down with a minimum of 0msec after the /RST has
been released. /CS can be applied at any time or can be permanently grounded. /RST has priority over /CS.
Notes:
1. There will be no damage to the ILI9488 if the power sequences are not met.
2. There will be no abnormal visible effects on the display panel during the Power On/Off Sequence.
3. There will be no abnormal visible effects on the display between the end of the Power On Sequence and
before receiving the Sleep Out command, and also between receiving the Sleep In command and the
Power Off Sequence.
4. If the /RST line is not steadily held by the host during the Power On Sequence as defined in Sections 11.1
and 11.2 ( ILI9488 datasheet ), then it will be necessary to apply the Hardware /RST after the completion
of the Host Power On Sequence to ensure correct operations. Otherwise, all the functions are not
guaranteed.
5. When the power is turned on, the climb period timing (Trise) must be greater than 10us.
6. Keep data pins D[17:0] at low level, or IOVDD comes later
Note ： Please refer to IC: ILI9488 data sheet for more details.
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5.6 Reset timing
Item
Symbol
MIN.
TYP.
MAX.
Unit
Reset LOW pulse width
t RW
1.0
-
-
us
Reset time
T RT
-
-
120
ms
Please refer to IC: ILI9488 data sheet for more details.
6 . Optical Characteristics
T OP =25 C
Item
Symbol Condition
Min
Typ
Max
Unit
Remark
θT
-
70
-
θB
-
60
-
View Angles
θL
CR ≧ 10
-
70
-
Degree
Note2,3
θR
-
70
-
Contrast Ratio
CR
θ= 0°
350
500
-
-
Note 3
T ON
Response Time
25 ℃
-
25
-
ms
Note 4
T OFF
x
0.236
0.286
0.336
White
y
0.266
0.316
0.366
x
0.586
0.636
0.686
Red
y
0.284
0.334
0.384
Note 1,5
-
x
Backlight is
0.276
0.326
0.376
Chromaticity
Green
y
0.543
0.593
0.643
on
x
0.100
0.150
0.200
Blue
y
0.027
0.077
0.127
Uniformity
U
80
-
-
%
Note 6
NTSC
S
Θ= 0°
60
-
-
%
Note 5
Luminance
L
Φ=0 o
250
300
-
cd/ ㎡
Note 7
Note ：
IF= 120mA, and the ambient temperature is 25 ℃
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7 . LCD Module Design and Handling Precautions
7. 液晶显示模块设计和使用须知
- Please ensure V0, VCOM is adjustable, to enable LCD - 请注意 V0, VCOM 的设定, 以确保液晶显示模块在不
module get the best contrast ratio under different
同的使用温度下以及在不同的视角和位置观察模块显
temperatures, view angles and positions.
示，均能达到最佳对比度，请务必将应用电路上设置
为对比度可调。
- Normally display quality should be judged under the - 请注意液晶显示模块的显示品质判定是指在正常对比
best contrast ratio within viewable area. Unexpected
度下以及视窗(V.A)范围内进行的，非正常对比度下
display pattern may com out under abnormal contrast
液晶可能会出现非预期的显示不良，应注意区分。
ratio.
- Never operate the LCD module exceed the absolute - 请勿在最大额定值以外使用液晶显示模块。
maximum ratings.
- Never apply signal to the LCD module without power - 请勿在没有接通电源的条件下，给液晶显示模块输送
supply.
信号。
- Keep signal line as short as possible to reduce external - 请尽可能缩短信号线的连接，以避免对液晶显示模块
noise interference.
的信号干扰。
- IC chip (e.g. TAB or COG) is sensitive to light. Strong - 集成电路因 IC 芯片(如 TAB 或 COG)对紫外线极为敏
light might cause malfunction. Light sealing structure
感，强光环境下可能会引起液晶显示模块功能失效，
casing is recommended.
故应采用不透光的外壳。
- Make sure there is enough space (with cushion) - 请在液晶显示模块与外壳之间保留足够的空间(可使
between case and LCD panel, to prevent external force
用衬垫)，以缓冲外力对液晶显示模块的损坏或因受
passed on to the panel; otherwise that may cause
力不均而产生的显示不匀等异常现象。
damage to the LCD and degrade its display result.
- Avoid showing a display pattern on screen for a long - 避免液晶显示屏在某一画面下长时间点亮，否则有出
time (continuous ON segment).
现残影的风险；请通过软件每隔一段时间改变一次画
面。
- LCD module reliability may be reduced by temperature - 液晶显示模块的可靠性可能因温度冲击而降低。
shock.
- When storing and operating LCD module, avoids - 请勿在阳光直射、高湿、高温或低温下储存和使用液
exposure to direct sunlight, high humidity, high or low
晶显示模块，这将造成液晶显示模块的损坏或失效。
temperature. They may damage or degrade the LCD
module.
- 请勿在极限环境(最大/最小存储/工作温度)下使用或
- Never leave LCD module in extreme condition
放置液晶显示模块超过 48 小时以上。
(max./min storage/operate temperature) for more than
48hr.
- Recommend LCD module storage conditions is - 液晶显示模块建议存储条件为: 0 C~40 C <80%RH 。
0 C~40 C <80%RH.
- LCD module should be stored in the room without acid, - 请勿让液晶显示模块存储于带有 酸性, 碱性, 有害
alkali and harmful gas.
气体环境之中。
- Avoid dropping & violent shocking during transportation, - 在运输过程中, 请勿让液晶显示模块跌落与猛烈震
and no excessive pressure press, moisture and sunlight.
动, 同时避免 异常挤压, 高湿度, 与阳光照射.
- LCD module can be easily damaged by static electricity. - 液晶显示模块极易受静电损坏，请务必保证液晶显示
Please maintain an optimum anti-static working
模块在防静电的工作环境中使用或保存。(如: 烙铁
environment to protect the LCD module. (eg. ground the
正确接地,等)
soldering irons properly)
- Be sure to ground the body when handling LCD module. - 拿取液晶显示模块时需注意操作人员的接地情况。
- Only hold LCD module by its sides. Never hold LCD - 请手持液晶显示模块的边沿取放模块，防止热压纸或
module by applying force on the heat seal or TAB.
TAB 部位受力。
- When soldering, control the temperature and duration - 焊接液晶模块时，请注意控制烙铁的温度、焊接时
avoid damaging the backlight guide or diffuser which
间，以免烫坏导光板或偏光片，导致显示不匀等不良
might degrade the display result such as uneven
现象发生。
display.
- Never let LCD module contact with corrosive liquids, - 请勿使用洗板水等腐蚀性液体接触液晶模块，以免腐
which might cause damage to the backlight guide or the
蚀导光板或模块电路。
electric circuit of LCD module.
- Only clean LCD with a soft dry cloth, Isopropyl Alcohol - 仅可使用柔软的干布, 异丙醇或乙醇清洁液晶屏表
or Ethyl Alcohol. Other solvents (e.g. water) may
面，其他任何溶剂(如:水)都有可能损坏液晶模块。
damage the LCD.
- Never add force to components of LCD module. It may - 请勿挤压液晶显示模块上的元器件，以避免产生潜在
cause invisible damage or degrade the module's
的损坏或失效而影响产品可靠性。
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reliability.
- When mounting LCD module, please make sure it is - 装配液晶显示模块时，请务必注意避免液晶显示模块
free from twisting, warping and bending.
的扭曲或变形。
- Do not add excessive force on surface of LCD, which - 请勿挤压液晶显示屏表面，这将导致显示颜色的异
may cause the display color change abnormally.
常。
- LCD panel is made with glass. Any mechanical shock - 液晶屏由玻璃制作而成，任何机械碰撞(如从高处跌
(e.g. dropping from high place) will damage the LCD
落)均有可能损坏液晶显示模块。
module.
- Protective film is attached on LCD screen. Be careful - 液晶屏表面带有保护膜, 揭除保护膜时需要注意可能
when peeling off this protective film, since static
产生的静电。
electricity may be generated.
- Polarizer on LCD gets scratched easily. If possible, do - 因液晶显示屏表面的偏光片极易划伤，安装完成之前
not remove LCD protective film until the last step of
请尽量不要揭下保护膜。
installation.
- When peeling off protective film from LCD, static charge - 请缓慢揭除保护膜，在此过程中液晶显示屏上可能会
may cause abnormal display pattern. The symptom is
产生静电线，此为正常情况，可在短时间内消失。
normal, and it will turn back to normal in a short while.
- LCD panel has sharp edges, please handle with care.
- 请注意避免被液晶显示屏的边缘割伤。
- Never attempt to disassemble or rework LCD module.
- 请不要试图拆卸或改造液晶显示模块。
- If display panel is damaged and liquid crystal substance - 当液晶显示屏出现破裂, 内部液晶液体可能流出; 相
leaks out, be sure not to get any in your mouth, if the
关液体不可吞吃, 绝对不可接触嘴巴, 如接触到皮肤
substance comes into contact with your skin or clothes
或衣服, 请使用肥皂与清水彻底清洗.
promptly wash it off using soap and water.
8 . CTP Mounting Instructions
8. 电容触摸屏安装指导
8.1 Surface Mounting (Figure 2)
8.1 嵌入安装（附图 2）
- As the CTP assembling on the countersink area with - 客户面框应具有使用双面胶粘贴 CTP 的结构沉台面，
double side adhesive.
其粘贴面要求平整且洁净无污以保证粘贴牢靠.
The countersink area should be flat and clean to ensure
the double side adhesive installation result.
- The Bezel is recommend to keep a gap ( ≥ 0.3mm each - 考虑到制作误差，建议面框与 CTP 盖板之间四周留有
side) around the cover lens for tolerance.
≥ 0.3mm 间隙.
- It is recommended to provide an additional support - 建议必要时在背面提供垫有胶垫附加支架(例如无安
bracket with gasket for backside support when
装结构的 TFT 模块)，应仅利用适当支撑以保持模块
necessary (e.g.
TFT module without mounding
位置.
structure). They should only provide appropriate support
and keep the module in place.
- The mounting structure should be strong enough to - 安装结构应具有足够的强度，以防止外部不均匀力或
prevent external uneven force or twist act onto the
扭曲力作用到模块上。
module
Figure 2
8.2 Additional Cover Lens Mounting (Figure 3)
8.2 覆加盖板（附图 3）
- For the case of additional cover Lens mounting, it is - 需要覆加玻璃盖板的安装，为确保其功能，有必要查
necessary to recheck with the CTP specification about
看产品规格书中有关盖板材料和厚度的说明.
the material and thickness to ensure the functionality.
- It should keep a 0.2~0.3mm gap between the cover lens - 玻璃盖板与 CTP 表面之间应留有 0.2～0.3mm 间隙.
and the CTP surface..
- The cover lens window should be bigger than the active - 玻璃盖板视窗应大于 CTP 动作区域，各边离动作区应
area of the CTP.It should be ≥ 0.5mm each side.
≥ 0.5mm。
- It is recommended to provide an additional support - 建议必要时在背面提供附加支架(例如无安装结构的
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bracket for backside support when necessary (e.g. slim
薄型 TFT 模块)，应仅利用适当支撑以保持模块位置.
type TFT module without mounding structure). They
should only provide appropriate support and keep the
module in place.
- The mounting structure should be strong enough to - 安装结构应具有足够的强度，以防止外部不均匀力或
prevent external uneven force or twist act onto the
扭曲力作用到模块上.
module.
Figure 3
Warranty
This product has been manufactured to our company’s specifications as a part for use in your company’s general
electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from general
electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power control
equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct risk to
human life and where extremely high levels of reliability are required. If the product is to be used in any of the above
applications, we will need to enter into a separate product liability agreement.
- We cannot accept responsibility for any defect, which may arise form additional manufacturing of the product
(including disassembly and reassembly), after product delivery.
- We cannot accept responsibility for any defect, which may arise after the application of strong external force to the
product.
- We cannot accept responsibility for any defect, which may arise due to the application of static electricity after the
product has passed our company’s acceptance inspection procedures.
- When the product is in CCFL models, CCFL service life and brightness will vary according to the performance of the
inverter used, leaks, etc. We cannot accept responsibility for product performance, reliability, or defect, which may
arise.
- We cannot accept responsibility for intellectual property of a third part, which may arise through the application of our
product to our assembly with exception to those issues relating directly to the structure or method of manufacturing
of our product.
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