LMT040EATFWA-NND
LCD Module User Manual
Prepared by:
Checked by:
Approved by:
Li KeKe
Date: 2021-06-24
Date:
Date:
Rev. Descriptions
Release Date
0.1
Preliminary
2021-06-24
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Table of Content
1. General Specification ............................................................................................................................... 3
2. Block Diagram ............................................................................................................................................ 3
3. Terminal Functions ................................................................................................................................... 4
3.1 Interface ...................................................................................................................................................... 4
4. Absolute Maximum Ratings .................................................................................................................... 5
5. Electrical Characteristics ........................................................................................................................ 5
5.1 DC Characteristics (MCU terminal) ........................................................................................................ 5
5.2 CTP operating characteristics ................................................................................................................. 5
5.3 LED Backlight Circuit Characteristics ..................................................................................................... 5
5.4 Block Diagram ............................................................................................................................................ 6
5.5 Timing Chart ............................................................................................................................................... 6
5.5.1 DE Mode Timing Diagram ............................................................................................................. 7
5.5.2 HV Mode Timing Diagram ............................................................................................................. 8
5.5.3 Reset timing .................................................................................................................................... 8
5.6 CTP I2C Timing ......................................................................................................................................... 9
5.7 Power ON/OFF Sequenc ....................................................................................................................... 10
6. Optical Characteristics .......................................................................................................................... 11
7. LCD Module Design and Handling Precautions .............................................................................. 13
8. CTP Mounting Instructions ................................................................................................................... 14
9. RTP Mounting Instructions ................................................................................................................... 15
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1. General Specification
Screen Size(Diagonal) :
4.0 inch
Resolution :
480(RGB) x 480
Signal Interface :
24bit parallel RGB interface
Color Depth :
16.7M color (24bit)
Dot Pitch :
0.1497 x 0.1462 (mm)
Pixel Configuration :
RGB Vertical Stripe
Display Mode :
Transmissive (normal Black )
Surface Treatment :
Glare Treatment
Viewing Direction :
Full View
Outline Dimension :
84 x 86x 3.4(mm)
(exclude FPC, see attached drawing for details)
Active Area :
71.865x 70.176 (mm)
Backlight :
White LED
Operating Temperature :
-20 ~ +70°C
Storage Temperature :
-30 ~ +80°C
Note:1 Color tune may slightly changed by temperature and driving voltage.
2. Block Diagram
TP_GND,TP_INT,TP_SDA
CTP Controller （ GT1151QM or equivalent ）
TP_SCL,TP_RESET,TP_VDD
LEDA
Backlight Circuit
LEDK1,LEDK2
480(RGB)x 480 pixels
TFT Panel
VDD,VSS
VDD,IOVDD,
TFT Driver
/RESET,DE,PCLK,HS,VS,/CS,SCL,SDA
ST7701s or equivalent
R0~R7,G0~G7,B0~B7
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3. Terminal Functions
3.1 Interface
Pin
No.
Pin
I/O
Descriptions
(K1)
Name
1
LEDA
P
Backlight LED Anode supply
2
LEDK1
P
Backlight LED Cathode supply
3
LEDK2
P
4
NC
-
-
5
VDD
Positive Power Supply
6
IOVDD
P
7
GND
Power Ground (0V)
8
/RESET
I
Initializes the chip with a low input. Be sure to execute a
power-on reset after supplying power.
9
DE
I
Data Enable Signal Input .(If not using, pull low)
10
PCLK
I
Clock signal; latching data at the falling edge
11
HS
I
Horizontal sync signal; negative polarity
12
VS
I
Vertical sync signal; negative polarity
13
GND
P
Power Ground (0V)
A chip select signal
14
/CS
I
Low: the chip is selected and accessible
High: the chip is not selected and not accessible
15
SCL
I
SCL: Serial clock input for SPI interface.
16
SDA
I
SDA: Serial data input pin for SPI Interface.
17~24
R0~R7
I
Red color data input
25~32
G0~G7
I
Green color data input
33~40
B0~B7
I
Blue color data input
41~43
GND
P
Power Ground (0V)
44
TP_GND
I
TP-Ground
45
TP_INT
I
External interrupt to the host
46
TP_SDA
I
CTP- I2C data input and output interface operation.
47
TP_SCL
I
CTP- I2C clock input
48
TP_RESET
I
CTP- External Reset, Low is active data at the rising edge
49
TP_VDD
I
CTP-Analog power supply
50
GND
P
Power Ground (0V)
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4. Absolute Maximum Ratings
Items
Symbol
Min.
Max.
Unit
Condition
Supply Voltage
V DD
-0.3
+3.6
V
GND = 0V
Operating Temperature
T OP
-20
+70
C
No Condensation
Storage Temperature
T ST
-30
+80
C
No Condensation
Cautions:
Any Stresses exceeding the Absolute Maximum Ratings may cause substantial damage to the device. Functional
operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure
to extreme conditions may affect device reliability.
5. Electrical Characteristics
5.1 DC Characteristics (MCU terminal)
GND=0V, T OP =25 C
Items
Symbol
MIN.
TYP.
MAX.
Unit Applicable Pin
Operating Voltage
V DD
2.6
2.8
3.6
V
VDD
Logic operating voltage
V DDI
1.65
1.8
3.6
V
VDD
Input High Voltage
V IH
0.7VDDI
-
VDDI
V
Input pins
Input Low Voltage
V IL
GND
-
0.3VDDI
V
Input pins
Frame Freq
F FRAME
-
60
-
Hz
Dot Data Clock
f DOTCLK
-
15
30
MHz
Operating Current (*1)
I DD
-
21
-
mA VDD
Note.
*1. test image is Black Mode, Frame Freq=15Hz
*2. DISP=0
5.2 CTP operating characteristics
Items
Symbol
MIN. TYP.
MAX.
Unit Applicable Pin
Operating Voltage
TP_V DD
2.7
2.8
3.6
V
Logic operating voltage
TP_ V DDI
1.6
1.8
1.9
V
TP_VDD active current
ITP_V DD_ACT
-
16
24
mA
TP_VDD deep sleep current
ITP_V DD_DS
-
-
20
uA
Operate temperature;
T OP
-20
25
70
C
Note: Please refer to IC: GT1151QM data sheet for more details.
5.3 LED Backlight Circuit Characteristics
If LEDA =40mA, T OP =25 C
Items
Symbol
MIN.
TYP.
MAX.
Unit Note
Forward Voltage
Vf
-
12.8
-
V
Forward Current
If LEDA
-
40
-
mA
Life Time
L
20,000
(30,000)
-
hr
Cautions:
Exceeding the recommended driving current could cause substantial damage to the backlight and shorten its lifetime.
No. of LEDs = 2x4 pcs
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5.4 Block Diagram
LCD module diagram
5.5 Timing Chart
RGB Interface timming
Note: Please refer to IC: ST7701S data sheet for more details
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Parameter
Symbol MIN. TYP.(*1)
MAX.
Unit
Remark
Horizontal Sync. Width(*3)
hpw
2
2
255
DCLK
Horizontal Sync. Back Porch(*3)
hbp
2
8
255
DCLK
Horizontal Sync. Front Porch(*3)
hfp
2
22
-
DCLK
Vertical Sync. Width(*4)
vs
2
2
254
Line
Vertical Sync. Back Porch(*4)
vbp
2
11
254
Line
Vertical Sync. Front Porch
vfp
2
2
90
Line
Note:
*1.DCLK=15MHZ(TYP),DCLK=30MHZ(MAX).
*2.frame<=60HZ.
*3.hpw+hbp+hfp>=600 clock.
*4.Vs+Vbp<=255 Line.
5.5.1 DE Mode Timing Diagram
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5.5.2 HV Mode Timing Diagram
Note: Please refer to IC: ST7701S data sheet for more details.
5.5.3 Reset timing
Item
Symbol
MIN.
TYP.
MAX.
Unit
Reset LOW pulse width
t RW
10
-
-
us
Reset time
T RT
-
-
120
ms
Note: Please refer to IC: ST7701S data sheet for more details.
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5.6 CTP I2C Timing
The timing of I2C Interface
Test conditions: 1.8V communication interface, 400kbps communication speed, 2K pull-up
resistance
Test conditions: 3.3V communication interface, 400kbps communication speed, 2K pull-up
resistance
Note: Please refer to IC: GT1151QM data sheet for more details.
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5.7 Power ON/OFF Sequenc
Note: Please refer to IC: ST7701S data sheet for more details.
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6. Optical Characteristics
Item
Symbol Condition
Min
Typ
Max
Unit
Remark
θT
70
80
-
View Angles
θB
CR ≧ 10
70
80
-
Degree Note2,3
θL
70
80
-
θR
70
80
-
Contrast Ratio
CR
θ =0 °
640
800
-
Note 3
T ON
Response Time
25 ℃
-
25
35
ms
Note 4
T OFF
x
0.290
0.320 0.350
White
Note 1,5
y
0.321
0.351
0.381
x
0.590
0.620
0.650
Red
Note 1,5
Chromaticity
Backlight is
y
0.330
0.360
0.390
x
on
0.302
0.332
0.362
Green
Note 1,5
y
0.566
0.596
0.626
x
0.117
0.147
0.177
Blue
Note 1,5
y
0.063
0.093
TBD
Uniformity
U
80
-
-
%
Note 6
NTSC
55
60
-
%
Note 5
Luminance
L
300
350
-
cd/ ㎡ Note 7
1. If LEDA = 40 mA, and the ambient temperature is 25 ℃ .
2. The test systems refer to Note 1 and Note 2.
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Note 1:
Note 2:
The data are measured after LEDs are turned on for 5 minutes.
The definition of viewing angle:
LCM displays full white. The brightness is the average value of 9 Refer to the graph below marked by θ and Ф
measured spots. Measurement equipment SR-3A (1°)
Measuring condition:
- Measuring surroundings: Dark room
- Measuring temperature: Ta=25 ℃ .
- Adjust operating voltage to get optimum contrast at
the center of the display.
Note 3:
The definition of contrast ratio (Test LCM using SR-3A (1° )):
Note 4:
Contrast
Luminance When LCD is at “White” state
Definition of Response time. (Test LCD using BM-7A(2°)):
Ratio(CR)
=
Luminance When LCD is at “Black” state
The output signals of photo detector are measured
(Contrast Ratio is measured in optimum common electrode
when the input signals are changed from
voltage)
“black” to “white”(falling time)
and from “white” to “black”(rising time), respectively.
The response time is defined as
the time interval between the 10% and 90% of amplitudes.Refer to
figure as below.
Note 5:
Note 6:
Definition of Color of CIE1931 Coordinate and NTSC Ratio.
The luminance uniformity is calculated by using following formula.
△ Bp = Bp (Min.) / Bp (Max.)×100 (%)
Color gamut:
Bp (Max.) = Maximum brightness in 9 measured spots
Area of RGB triangle
S=
X100%
Bp (Min.) = Minimum brightness in 9 measured spots .
Area of NTSC triangle
Note 7:
Measured the luminance of white state at center point
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7. LCD Module Design and Handling Precautions
7. 液晶显示模块设计和使用须知
- Please ensure V0, VCOM is adjustable, to enable LCD module - 请注意 V0, VCOM 的设定, 以确保液晶显示模
get the best contrast ratio under different temperatures, view
块在不同的使用温度下以及在不同的视角和位
angles and positions.
置观察模块显示，均能达到最佳对比度，请务
必将应用电路上设置为对比度可调。
- Normally display quality should be judged under the best - 请注意液晶显示模块的显示品质判定是指在正
contrast ratio within viewable area. Unexpected display pattern
常对比度下以及视窗(V.A)范围内进行的，非正
may come out under abnormal contrast ratio.
常对比度下液晶可能会出现非预期的显示不
- Never operate the LCD module exceed the absolute maximum
良，应注意区分。
ratings.
- 请勿在最大额定值以外使用液晶显示模块。
- Never apply signal to the LCD module without power supply.
- 请勿在没有接通电源的条件下，给液晶显示模
- Keep signal line as short as possible to reduce external noise
块输送信号。
interference.
- 请尽可能缩短信号线的连接，以避免对液晶显
- IC chip (e.g. TAB or COG) is sensitive to light. Strong light
示模块的信号干扰。
might cause malfunction. Light sealing structure casing is - 集成电路因 IC 芯片(如 TAB 或 COG)对紫外线极
recommended.
为敏感，强光环境下可能会引起液晶显示模块
功能失效，故应采用不透光的外壳。
- Make sure there is enough space (with cushion) between case - 请在液晶显示模块与外壳之间保留足够的空间
and LCD panel, to prevent external force passed on to the
(可使用衬垫)，以缓冲外力对液晶显示模块的
panel; otherwise that may cause damage to the LCD and
损坏或因受力不均而产生的显示不匀等异常现
degrade its display result.
象。
- Avoid showing a display pattern on screen for a long time
(continuous ON segment).
- 避免液晶显示屏在某一画面下长时间点亮，否
则有出现残影的风险；请通过软件每隔一段时
- LCD module reliability may be reduced by temperature shock.
间改变一次画面。
- When storing and operating LCD module, avoids exposure to - 液晶显示模块的可靠性可能因温度冲击而降
direct sunlight, high humidity, high or low temperature. They
低。
may damage or degrade the LCD module.
- 请勿在阳光直射、高湿、高温或低温下储存和
- Never leave LCD module in extreme condition (max./min
使用液晶显示模块，这将造成液晶显示模块的
storage/operate temperature) for more than 48hr.
损坏或失效。
- Recommend LCD module storage conditions is 0 C~40 C
<80%RH.
- 请勿在极限环境(最大/最小存储/工作温度)下
- LCD module should be stored in the room without acid, alkali
使用或放置液晶显示模块超过 48 小时以上。
and harmful gas.
- 液 晶 显 示 模 块 建 议 存 储 条 件 为 : 0 C~40 C
- Avoid dropping & violent shocking during transportation, and
<80%RH 。
no excessive pressure press, moisture and sunlight.
- 请勿让液晶显示模块存储于带有 酸性, 碱性,
- LCD module can be easily damaged by static electricity.
有害气体环境之中。
Please maintain an optimum anti-static working environment to - 在运输过程中, 请勿让液晶显示模块跌落与猛
protect the LCD module. (eg. ground the soldering irons
烈震动, 同时避免 异常挤压, 高湿度, 与阳光
properly)
照射.
- Be sure to ground the body when handling LCD module.
- 液晶显示模块极易受静电损坏，请务必保证液
- Only hold LCD module by its sides. Never hold LCD module
晶显示模块在防静电的工作环境中使用或保
by applying force on the heat seal or TAB.
存。(如: 烙铁正确接地,等)
- When soldering, control the temperature and duration avoid - 拿取液晶显示模块时需注意操作人员的接地情
damaging the backlight guide or diffuser which might degrade
况。
the display result such as uneven display.
- 请手持液晶显示模块的边沿取放模块，防止热
- Never let LCD module contact with corrosive liquids, which
压纸或 TAB 部位受力。
might cause damage to the backlight guide or the electric - 焊接液晶模块时，请注意控制烙铁的温度、焊
circuit of LCD module.
接时间，以免烫坏导光板或偏光片，导致显示
- Only clean LCD with a soft dry cloth, Isopropyl Alcohol or Ethyl
不匀等不良现象发生。
Alcohol. Other solvents (e.g. water) may damage the LCD.
- 请勿使用洗板水等腐蚀性液体接触液晶模块，
- Never add force to components of LCD module. It may cause
以免腐蚀导光板或模块电路。
invisible damage or degrade the module's reliability.
- When mounting LCD module, please make sure it is free from - 仅可使用柔软的干布, 异丙醇或乙醇清洁液晶
twisting, warping and bending.
屏表面，其他任何溶剂(如:水)都有可能损坏液
- Do not add excessive force on surface of LCD, which may
晶模块。
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cause the display color change abnormally.
- 请勿挤压液晶显示模块上的元器件，以避免产
- LCD panel is made with glass. Any mechanical shock (e.g.
生潜在的损坏或失效而影响产品可靠性。
dropping from high place) will damage the LCD module.
- 装配液晶显示模块时，请务必注意避免液晶显
示模块的扭曲或变形。
- 请勿挤压液晶显示屏表面，这将导致显示颜色
的异常。
- 液晶屏由玻璃制作而成，任何机械碰撞(如从高
处跌落)均有可能损坏液晶显示模块。
- Protective film is attached on LCD screen. Be careful when - 液晶屏表面带有保护膜, 揭除保护膜时需要注
peeling off this protective film, since static electricity may be
意可能产生的静电。
generated.
- 因液晶显示屏表面的偏光片极易划伤，安装完
- Polarizer on LCD gets scratched easily. If possible, do not
成之前请尽量不要揭下保护膜。
remove LCD protective film until the last step of installation.
- 请缓慢揭除保护膜，在此过程中液晶显示屏上
- When peeling off protective film from LCD, static charge may
可能会产生静电线，此为正常情况，可在短时
cause abnormal display pattern. The symptom is normal, and
间内消失。
it will turn back to normal in a short while.
- LCD panel has sharp edges, please handle with care.
- 请注意避免被液晶显示屏的边缘割伤。
- Never attempt to disassemble or rework LCD module.
- 请不要试图拆卸或改造液晶显示模块。
- If display panel is damaged and liquid crystal substance leaks - 当液晶显示屏出现破裂, 内部液晶液体可能流
out, be sure not to get any in your mouth, if the substance
出; 相关液体不可吞吃, 绝对不可接触嘴巴,
comes into contact with your skin or clothes promptly wash it
如接触到皮肤或衣服, 请使用肥皂与清水彻底
off using soap and water.
清洗.
8. CTP Mounting Instructions
8. 电容触摸屏安装指导
8.1 Bezel Mounting (Figure 1)
8.1 面框安装（附图 1）
- The bezel window should be bigger than the CTP active area.
- 客户面框窗口应大于 CTP 动作区域，各边离动
It should be ≥ 0.5mm each side.
作区应≥0.5mm.
- Gasket should be installed between the bezel and the CTP
- 面框与 CTP 面板间应垫有胶垫，其最终间隙约
surface.
为 0.5～1.0mm.
The final gap should be about 0.5~1.0mm.
- 建议必要时在背面提供附加支架(例如无安装结
- It is recommended to provide an additional support bracket for
构的薄型 TFT 模块)，应仅利用适当支撑以保持
backside support when necessary (e.g. slim type TFT module
模块位置.
without mounding structure). They should only provide
appropriate support and keep the module in place.
- The mounting structure should be strong enough to prevent
- 安装结构应具有足够的强度，以防止外部不均
external uneven force or twist act onto the module.
匀力或扭曲力作用到模块上.
Figure 1
8.2 Surface Mounting (Figure 2)
8.2 嵌入安装（附图 2）
- As the CTP assembling on the countersink area with double - 客户面框应具有使用双面胶粘贴 CTP 的结构沉
side adhesive.
台面，其粘贴面要求平整且洁净无污以保证粘
The countersink area should be flat and clean to ensure the
贴牢靠.
double side adhesive installation result.
- The Bezel is recommend to keep a gap ( ≥ 0.3mm each side)
around the cover lens for tolerance.
- 考虑到制作误差，建议面框与 CTP 盖板之间四
- It is recommended to provide an additional support bracket
周留有≥0.3mm 间隙.
with gasket for backside support when necessary (e.g. TFT - 建议必要时在背面提供垫有胶垫附加支架(例如
module without mounding structure). They should only provide
无安装结构的 TFT 模块)，应仅利用适当支撑以
appropriate support and keep the module in place.
保持模块位置.
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LCD Module User Manual
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- The mounting structure should be strong enough to prevent
external uneven force or twist act onto the module
- 安装结构应具有足够的强度，以防止外部不均
匀力或扭曲力作用到模块上。
Figure 2
8.3 Additional Cover Lens Mounting (Figure 3)
8.3 覆加盖板（附图 3）
- For the case of additional cover Lens mounting, it is necessary - 需要覆加玻璃盖板的安装，为确保其功能，有
to recheck with the CTP specification about the material and
必要查看产品规格书中有关盖板材料和厚度的
thickness to ensure the functionality.
说明.
- It should keep a 0.2~0.3mm gap between the cover lens and
the CTP surface..
- 玻璃盖板与 CTP 表面之间应留有 0.2～0.3mm 间
- The cover lens window should be bigger than the active area
隙.
of the CTP.It should be ≥ 0.5mm each side.
- It is recommended to provide an additional support bracket for - 玻璃盖板视窗应大于 CTP 动作区域，各边离动
backside support when necessary (e.g. slim type TFT module
作区应≥0.5mm。
without mounding structure). They should only provide - 建议必要时在背面提供附加支架(例如无安装结
appropriate support and keep the module in place.
构的薄型 TFT 模块)，应仅利用适当支撑以保持
- The mounting structure should be strong enough to prevent
模块位置.
external uneven force or twist act onto the module.
- 安装结构应具有足够的强度，以防止外部不均
匀力或扭曲力作用到模块上.
Figure 3
9. RTP Mounting Instructions
9. 电阻触摸屏安装指导
- It should bezel touching the RTP Active Area (A.A.) to prevent
- 为避免面框直接压在动作区(A.A.)上造成误动
作，面框与电阻触摸屏(RTP)之间应留有一定的
abnormal touch.It should left gab D=0.2~0.3mm in between.
空隙 D=0.2~0.3mm 之间.(附图 4)
(Figure 4)
- Outer bezel design should take care about the area outside
- 设计面框时，要注意用面框保护触摸屏四周的
the A.A. Those areas contain circuit wires which is having
非保证操作区域，因为布线区域在此处形成一
different thickness. Touching those areas could de-form the
台阶，在此区域附近操作时 ITO Film 变形较
ITO film. As a result bezel the ITO film be damaged and
大，容易导致 ITO 损坏而降低寿命。为保护
shorten its lifetime.
RTP 和避免误操作，在 RTP 与面框之间垫缓冲
It is suggested to protect those areas with gasket (between the
物（Gasket），我们建议设计面框应覆盖动作
bezel and RTP).The suggested figures are B≥0.50mm;
区的边缘，面框边缘到 V.A.区的距离
C≥0.50mm. (Figure 4)
B≥0.50mm; 垫圈内边缘到 V.A.区的距离
C≥0.50mm. (附图 4)
- The bezel side wall should keep space E= 0.2 ~ 0.3mm from
- 在设计面框与 RTP 组装时，应考虑到面框内侧
the RTP. (Figure 4)
与 RTP 外侧的间距 E≥0.2mm. (附图 4)
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LCD Module User Manual
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Figure 4
- In general design,
- 通常设计时：
RTP V.A. should be bigger than the TFT V.A.
RTP 的可视区 V.A. 应不小于 TFT 的可视区
and RTP A.A. should be bigger than the TFT A.A.
V.A.
(Figure 5)
及 RTP 的动作区 A.A. 应不小于 TFT 的动作区
A.A.
(附图 5)
Figure 5
Warranty
This product has been manufactured to our company’s specifications as a part for use in your company’s general
electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from
general electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power
control equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct
risk to human life and where extremely high levels of reliability are required. If the product is to be used in any of the
above applications, we will need to enter into a separate product liability agreement.
- We cannot accept responsibility for any defect, which may arise form additional manufacturing of the product
(including disassembly and reassembly), after product delivery.
- We cannot accept responsibility for any defect, which may arise after the application of strong external force to the
product.
- We cannot accept responsibility for any defect, which may arise due to the application of static electricity after the
product has passed our company’s acceptance inspection procedures.
- When the product is in CCFL models, CCFL service life and brightness will vary according to the performance of the
inverter used, leaks, etc. We cannot accept responsibility for product performance, reliability, or defect, which may
arise.
- We cannot accept responsibility for intellectual property of a third part, which may arise through the application of
our product to our assembly with exception to those issues relating directly to the structure or method of
manufacturing of our product.
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