LMT070DNCFWD-NNC-1
LCD Module User Manual
Prepared by:
Checked by:
Approved by:
Song Mao
Date: 2021-06-08
Date:
Date:
Rev.
Descriptions
Edit
Release Date
0.1
Preliminary release
Song Mao 2021-06-08
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Table of Content
1. General Specification ............................................................................................................................... 3
2. Block Diagram ............................................................................................................................................ 3
3. Terminal Function ..................................................................................................................................... 4
3.1 K1 TFT Input Terminal ..................................................................................................................................................................... 4
3.2 K2 CTP Input Terminal .................................................................................................................................................................... 5
4. Absolute Maximum Ratings .................................................................................................................... 5
5. Electrical Characteristics ........................................................................................................................ 6
5.1 DC Characteristics ........................................................................................................................................................................... 6
5.2 LED Backlight Circuit Characteristics ............................................................................................................................................ 6
5.3 Power ON/OFF Sequence .............................................................................................................................................................. 7
6. AC Characteristics .................................................................................................................................... 8
6.1 TFT Timing Characteristics ........................................................................................................................................................... 8
6.2 Recommended Timing Setting Of TCON ..................................................................................................................................... 9
6.3 Horizontal input timing Diagram ..................................................................................................................................................... 9
6.4 I 2 C Timing Characteristics(CTP) .................................................................................................................................................. 10
7. CTP Functional Characteristics ........................................................................................................... 10
7.1 CTP Coordinate .............................................................................................................................................................................. 10
7.2 I 2 C Slave Addresses ...................................................................................................................................................................... 11
7.3 I 2 C Data Transmission .................................................................................................................................................................. 12
7.4 CTP Register ................................................................................................................................................................................... 13
8. Optical Characteristics .......................................................................................................................... 15
9. LCD Module Design and Handling Precautions .............................................................................. 17
10. CTP Mounting Instructions ................................................................................................................. 18
11. RTP Mounting Instructions ................................................................................................................. 19
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1. General Specification
TFT Interface :
Digital 24-bits RGB
CTP Interface:
I 2 C
Display Technology :
a-Si TFT
Display Mode :
Transmissive / Normal White
Screen Size(Diagonal) :
7.0”
Outline Dimension :
164.9 x 100.0 x 7.28 (mm)
(see attached drawing for details)
Active Area :
154.08 x 85.92 (mm)
Number of dots :
800 x 3 (RGB) x 480
Pixel Pitch :
0.1926 x 0.179 (mm)
Pixel Configuration :
RGB Stripe
Backlight :
LED
Viewing Direction :
6 o’clock(Gray scale Inversion) (*1)
12 o’clock (*2)
Operating Temperature :
-20 ~ +70°C
Storage Temperature :
-30 ~ +80°C
Touch Panel Type :
Capacitive Touch Panel(*4)
Touch points:
5 points touch
Note:
*1. For saturated color display content (eg. pure-red, pure-green, pure-blue or pure-colors-combinations).
*2. For “color scales” display content.
*3. Color tone may slightly change by temperature and driving condition.
*4. Applicable cover panel/cover glass thickness = 2.0MAX.(Without air gap)
2. Block Diagram
VDD , VSS
SDA , SCL
Capacitive Touch Panel
INT , RST
BLA , BLK
Backlight Circuit
VCC, GND
VGH, VGL , AVDD ,VCOM
7’’ TFT Panel
DCLK
DE, HS, VS
MODE
DITHB
R0~R7, G0~G7, B0~B7
Source Driver
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3. Terminal Function
3.1 K1 TFT Input Terminal
Pin No. Pin Name
I/O
Descriptions
1
BLA
2
BLA
Power
Positive Backlight Power Supply
3
BLK
4
BLK
Power
Negative Backlight Power Supply
5
GND
Power
Power GND (0V)
6
VCOM
Input
Common voltage
7
VCC
Power
Power for Digital Circuit
8
MODE
Input
DE/SYNC mode select (*1)
9
DE
Input
Data input enable
10
VS
Input
Vertical Sync Input
11
HS
Input
Horizontal Sync Input
12
B7
:
:
Input
8bit Data for Blue
19
B0
20
G7
:
:
Input
8bit Data for Green
27
G0
28
R7
:
:
Input
8bit Data for Red
35
R0
36
GND
Power
Power GND (0V)
37
DCLK
Input
Sample clock(*2)
38
GND
Power
Power GND (0V)
39
L/R
Input
Left / right selection (*3)
40
U/D
Input
Up/down selection (*3)
41
VGH
Power
Gate ON Voltage
42
VGL
Power
Gate OFF Voltage
43
AVDD
Power
Power for Analog Circuit
44
RESET
Input
Global reset pin (*4)
45
NC
-
No connection
46
VCOM
Input
Common Voltage
47
DITHB
Input
Dithering function,H: 6bit resolution ,L: 8bit resolution
48
GND
Power
Power GND (0V)
49
NC
-
50
NC
No connection
Note:
* 1: DE/SYNC mode select. Normally pull high.
When select DE mode, MODE=”1”, VS and HS must pull high.
When select SYNC mode, MODE= “0”, DE must be grounded.
* 2: Data shall be latched at the falling edge of DCLK.
* 3: Selection of scanning mode
Setting of scan control input
Scanning direction
U/D
L/R
GND
VCC
Up to down, left to right
VCC
GND
Down to up, right to left
GND
GND
Up to down, right to left
VCC
VCC
Down to up, left to right
*4: Global reset pin. Active low to enter reset state. Suggest to connect with an RC reset circuit for stability. Normally pull high.
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3.2 K2 CTP Input Terminal
Pin No Pin Name
I/O
Descriptions
1
/RST
P
Global reset pin, active low reset
2
VDD
P
Power supply
3
VSS
P
Ground
4
/INT
I
Interrupt signal, active low Interrupt
5
SDA
I/O
I ² C data
6
SDL
I
I ² C clock
Note
*1.Note:The capacitance touch drive IC is GT911.
4. Absolute Maximum Ratings
Items
Symbol
Min.
Max.
Unit
Condition
V DD
-0.3
5.0
V
V CC
-0.3
3.96
V
Power voltage
AV DD
-0.3
14.5
V
V GH
-0.3
42
V
V GL
V GH -42
0.3
V
Operating Temperature
T OP
-20
70
C
No Condensation
Storage Temperature
T ST
-30
80
C
No Condensation
Note:
*1.This rating applies to all parts of the module. And should not be exceeded.
*2.The operating temperature only guarantees operation of the circuit. The contrast, response speed,
and the other specification related to electro-optical display quality is determined at the room temperature, T OP =25.
*3.Ambient temperature when the backlight is lit (reference value)
*4.Any Stresses exceeding the Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of
this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme
conditions may affect device reliability.
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5. Electrical Characteristics
5.1 DC Characteristics
VCC= VDD=3.3V,GND=VSS=0V, Top=25 ℃
Items
Symbol
Min.
Typ.
Max.
Unit
Remark
V DD
3.0
3.3
3.6
V
V CC
3.0
3.3
3.6
V
*2
Power voltage
AV DD
10.2
10.4
10.6
V
V GH
15
16.0
17
V
V GL
-7.5
-7.0
-6.5
V
Input signal voltage
V COM
4.05
4.15
4.25
V
Input logic high voltage
V IH
0.7V CC
-
V CC
V
Input logic low voltage
V IL
0
-
0.3V CC
V
*3
Note:
*1: Be sure to apply VCC and VGL to the LCD first, and then apply VGH.
*2: VCC setting should match the signals output voltage (refer to Note 3) of customer’s system board.
*3: DCLK,HS,VS,RESET,U/D, L/R,DE,R0~R7,G0~G7,B0~B7,MODE,DITHB,/RST,/INT,SDA,SDL.
5.2 LED Backlight Circuit Characteristics
Top=25 ℃
Items
Symbol
MIN.
TYP.
MAX.
Unit
Note
Forward Voltage
Vf
9.0
9.6
10.5
V
If = 180mA
Forward Current
If
-
180
mA
Cautions :
Exceeding the recommended driving current could cause substantial damage to the backlight and shorten its lifetime.
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5.3 Power ON/OFF Sequence
Note :
*1. t0<20ms, t1>1ms, t2>16ms, t3 ≥ 0ms, t4 ≥ 0ms, t5 ≥ 0ms, t6 ≥ 0ms, t7 ≥ 8 frames(will be helpful to release the electric charge on
panel)
*2.Data include R0~R7,B0~B7,G0~G7,U/D,L/R,DCLK,HS,VS,DE.
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6. AC Characteristics
6.1 TFT Timing Characteristics
Item
Symbol
MIN.
TYP.
MAX. Unit
Remark
HS setup time
Thst
8
-
-
ns
HS hold time
Thhd
8
-
-
ns
VS setup time
Tvst
8
-
-
ns
VS hold time
Tvhd
8
-
-
ns
Data setup time
Tdsu
8
-
-
ns
Data hole time
Tdhd
8
-
-
ns
DE setup time
Tesu
8
-
-
ns
V CC Power On Slew rate
TPOR
-
-
20
ms
From 0 to 90% V CC
DCLK cycle time
Tcph
20
-
-
ns
DCLK pulse duty
Tcwh
40
50
60
%
Note: For the details of the timing, please see the Driver IC data sheet.
Input Clock and Data Timing Diagram
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6.2 Recommended Timing Setting Of TCON
TCON (Embedded In Source IC) Input Timing (DCLK, HSD, VSD, DE)
VCC=3.3V, AVDD=10.4V, GND=0V, Ta=25 ℃
Item
Symbol
MIN.
TYP.
MAX. Unit
Remark
DCLK
fclk
28
33.3
40
MHz
thd
-
800
-
DCLK
th
862
1056
1200
DCLK
HSD
thpw
1
-
40
DCLK
thb
46
46
46
DCLK
thfp
16
210
354
DCLK
tvd
-
480
-
TH
tv
513
525
650
TH
VSD
tvpw
3
-
20
TH
tvb
23
23
23
TH
tvfp
7
22
147
TH
Note: DE timing refer to HSD, VSD input timing .
Vertical input timing Diagram:
6.3 Horizontal input timing Diagram
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6.4 I 2 C Timing Characteristics(CTP)
Item
Symbol
MIN.
MAX. Unit
Remark
SCL low period
tlo
1.3
-
us
SCL high period
thi
0.6
-
us
SCL setup time for Start condition
tst1
0.6
-
us
SCL setup time for Stop condition
tst3
0.6
-
us
SCL hold time for Start condition
thd1
0.6
-
us
SDA setup time
tst2
0.1
-
us
SDA hold time
thd2
0
-
us
Input SDA and SCL Timing Diagram
7. CTP Functional Characteristics
7.1 CTP Coordinate
(0,0)
Y
X
(799,479)
Note: *1: Top left corner is the origin.
* 2: Default resolution 800*480.
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7.2 I 2 C Slave Addresses
CTP has 2 sets of slave address 0xBA/0xBB & 0x28/29. Master can control Reset & INT pin
to configure the slave address in power on initial state like following:
Power on diagram:
Timing for setting slave address to 0x28/0x29:
Timing for setting slave address to 0xBA/0xBB:
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7.3
I 2 C Data Transmission
(For example : device address is 0xBA/0xBB)
1. Communication is always initiated by the host. Valid Start condition is signaled by pulling SDA linefrom
“high” to “low” when SCL line is “high”. Data flow or address is transmitted after the Startcondition.
2. All slave devices connected to I2C bus should detect the 8-bit address issued after Start condition and
send the correct ACK. After receiving matching address, GT911 acknowledges by configuring SDA
line as output port and pulling SDA line low during the ninth SCL cycle. When receiving
unmatchedaddress, namely, not 0XBA or 0XBB, GT911 will stay in an idle state.
3. For data bytes on SDA, each of 9 serial bits will be sent on nine SCL cycles. Each data byte consists.of 8
valid data bits and one ACK or NACK bit sent by the recipient. The data transmission is valid when SCL
line is “high”.
4. When communication is completed, the host will issue the STOP condition. Stop condition implies
the.transition of SDA line from “low” to “high” when SCL line is “high”.
CTP I 2 C Data Write
(For example : device address is 0xBA/0xBB)
1. The diagram above displays the timing sequence of the host writing data onto GT911. First, the host
issues a Start condition. Then, the host sends 0XBA (address bits and R/W bit; R/W bit as 0 indicates
Write operation) to the slave device.
2. After receiving ACK, the host sends the 16-bit register address (where writing starts) and the 8-bit
data bytes (to be written onto the register).
3. The location of the register address pointer will automatically add 1 after every Write Operation.
Therefore, when the host needs to perform Write Operations on a group of registers of continuous
addresses, it is able to write continuously. The Write Operation is terminated when the host issues the
Stop condition.
CTP I 2 C Data Read
(For example : device address is 0xBA/0xBB)
1 . The diagram above is the timing sequence of the host reading data from GT911. First, the host issues.a
Start condition and sends 0XBA (address bits and R/W bit; R/W bit as 0 indicates Write operation)
to the slave device.
2. After receiving ACK, the host sends the 16-bit register address (where reading starts) to the slave
device. Then the host sets register addresses which need to be read.
3. Also after receiving ACK, the host issues the Start condition once again and sends 0XBB (Read
Operation). After receiving ACK, the host starts to read data.
4. GT911 also supports continuous Read Operation and, by default, reads data continuously.
Whenever.receiving a byte of data, the host sends an ACK signal indicating successful reception. After
receiving.the last byte of data, the host sends a NACK signal followed by a STOP condition which
terminates communication.
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7.4
CTP Register
Register Table
Register
Access
Descriptions
0x8140
R
Product ID ( first byte , ASCII )
0x8141
R
Product ID ( second byte , ASCII )
0x8142
R
Product ID ( third byte , ASCII )
0x8143
R
Product ID ( forth byte , ASCII )
0x8144
R
Firmware version ( HEX.low byte )
0x8145
R
Firmware version ( HEX.high byte )
0x8146
R
x coordinate resolution ( low byte )
0x8147
R
x coordinate resolution ( high byte )
0x8148
R
y coordinate resolution ( low byte )
0x8149
R
y coordinate resolution ( high byte )
0x814A
R
Vendor_id ( current module option information )
0x814B
R
Reserved
0x814C
R
Reserved
0x814D
R
Reserved
D[7,6]: buffer status
D[5,4]: large detect
0x814E
R/W
D[3,2]: reserved
D[1,0]: number of touch points
0x814F
R
track id
0x8150
R
point 1 x coordinate (low byte)
0x8151
R
point 1 x coordinate (high byte)
0x8152
R
point 1 y coordinate (low byte)
0x8153
R
point 1 y coordinate (high byte)
0x8154
R
Point 1 size (low byte)
0x8155
R
point 1 size (high byte)
0x8156
R
Reserved
0x8157
R
track id
0x8158
R
point 2 x coordinate (low byte)
0x8159
R
point 2 x coordinate (high byte)
0x815A
R
point 2 y coordinate (low byte)
0x815B
R
point 2 y coordinate (high byte)
0x815C
R
point 2 size (low byte)
0x815D
R
point 2 size (high byte)
0x815E
R
Reserved
0x815F
R
track id
0x8160
R
point 3 x coordinate (low byte)
0x8161
R
point 3 x coordinate (high byte)
0x8162
R
point 3 y coordinate (low byte)
0x8163
R
point 3 y coordinate (high byte)
0x8164
R
point 3 size (low byte)
0x8165
R
point 3 size (high byte)
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Register
Access
Descriptions
0x8166
R
Reserved
0x8167
R
track id
0x8168
R
point 4 x coordinate (low byte)
0x8169
R
point 4 x coordinate (high byte)
0x816A
R
point 4 y coordinate (low byte)
0x816B
R
point 4 y coordinate (high byte)
0x816C
R
point 4 size (low byte)
0x816D
R
point 4 size (high byte)
0x816E
R
Reserved
0x816F
R
track id
0x8170
R
point 5 x coordinate (low byte)
0x8171
R
point 5 x coordinate (high byte)
0x8172
R
point 5 y coordinate (low byte)
0x8173
R
point 5 y coordinate (high byte)
0x8174
R
point 5 size (low byte)
0x8175
R
point 5 size (high byte)
0x8176
R
Reserved
0x8177
R
Reserved
Note:Please refer to C911 IC datasheet for detail
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8. Optical Characteristics
Item
Symbo
MIN
l
Condition
.
TYP.
MAX. UNIT
Note.
θ L
60
80
-
Viewing angle
θ R
60
80
-
(CR ≥ 10)
CR 10
degree
*2
θ T
50
60
-
θ B
60
80
-
T ON
Response Time
-
25
35
msec
*3
T OFF
Contrast ratio
CR
600 800
-
-
W X
Normal
0.26 0.31
0.36
-
*1
Color chromaticlty
W Y
θ=0 o
0.28 0.33
0.38
-
Luminance
L
-
400
-
Cd/m 2
*4
Luminance uniformity
Y U
70
75
-
%
*4
Note:
*1. Definition of Contrast Ratio
The contrast ratio could be calculate by the following expression:
Contrast Ratio (CR) = Luminanc with all pixels white / Luminance with all pixels black
*2 Definition of Viewing Angle
*3 Definition of response time
*4 Definition of Luminance Uniformity
Luminance uniformity (Lu)=Mi. Luminance form pt1~pt9 / Max Luminance form Pt1~pt9
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Note 5:
Note 6:
Definition of Color of CIE1931 Coordinate and NTSC Ratio.
The luminance uniformity is calculated by using following
formula.
Color gamut:
△ Bp = Bp (Min.) / Bp (Max.)×100 (%)
Area of RGB triangle
S=
X100%
Bp (Max.) = Maximum brightness in 9 measured spots
Area of NTSC triangle
Bp (Min.) = Minimum brightness in 9 measured spots .
Note 7:
Measured the luminance of white state at center point
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9. LCD Module Design and Handling
7. 液晶显示模块设计和使用须知
Precautions
- Please ensure V0, VCOM is adjustable, to enable LCD module - 请注意 V0, VCOM 的设定, 以确保液晶显示模
get the best contrast ratio under different temperatures, view
块在不同的使用温度下以及在不同的视角和位
angles and positions.
置观察模块显示,均能达到最佳对比度,请务
必将应用电路上设置为对比度可调。
- Normally display quality should be judged under the best contrast - 请注意液晶显示模块的显示品质判定是指在正
ratio within viewable area. Unexpected display pattern may com
常对比度下以及视窗(V.A)范围内进行的,非正
out under abnormal contrast ratio.
常对比度下液晶可能会出现非预期的显示不
- Never operate the LCD module exceed the absolute maximum
良,应注意区分。
ratings.
- 请勿在最大额定值以外使用液晶显示模块。
- Never apply signal to the LCD module without power supply.
- 请勿在没有接通电源的条件下,给液晶显示模
- Keep signal line as short as possible to reduce external noise
块输送信号。
interference.
- 请尽可能缩短信号线的连接,以避免对液晶显
- IC chip (e.g. TAB or COG) is sensitive to light. Strong light might
示模块的信号干扰。
cause malfunction. Light sealing structure casing is - 集成电路因 IC 芯片(如 TAB 或 COG)对紫外线极
recommended.
为敏感,强光环境下可能会引起液晶显示模块
功能失效,故应采用不透光的外壳。
- Make sure there is enough space (with cushion) between case - 请在液晶显示模块与外壳之间保留足够的空间
and LCD panel, to prevent external force passed on to the panel;
(可使用衬垫),以缓冲外力对液晶显示模块的
otherwise that may cause damage to the LCD and degrade its
损坏或因受力不均而产生的显示不匀等异常现
display result.
象。
- Avoid showing a display pattern on screen for a long time
(continuous ON segment).
- 避免液晶显示屏在某一画面下长时间点亮,否
则有出现残影的风险;请通过软件每隔一段时
- LCD module reliability may be reduced by temperature shock.
间改变一次画面。
- When storing and operating LCD module, avoids exposure to - 液晶显示模块的可靠性可能因温度冲击而降
direct sunlight, high humidity, high or low temperature. They may
低。
damage or degrade the LCD module.
- 请勿在阳光直射、高湿、高温或低温下储存和
- Never leave LCD module in extreme condition (max./min
使用液晶显示模块,这将造成液晶显示模块的
storage/operate temperature) for more than 48hr.
损坏或失效。
- Recommend LCD module storage conditions is 0 C~40 C
<80%RH.
- 请勿在极限环境(最大/最小存储/工作温度)下
- LCD module should be stored in the room without acid, alkali and
使用或放置液晶显示模块超过 48 小时以上。
harmful gas.
- : 0 C~40 C
- Avoid dropping & violent shocking during transportation, and no
<80%RH 。
excessive pressure press, moisture and sunlight.
- 请勿让液晶显示模块存储于带有 酸性, 碱性,
- LCD module can be easily damaged by static electricity. Please
有害气体环境之中。
maintain an optimum anti-static working environment to protect - 在运输过程中, 请勿让液晶显示模块跌落与猛
the LCD module. (eg. ground the soldering irons properly)
烈震动, 同时避免 异常挤压, 高湿度, 与阳光
- Be sure to ground the body when handling LCD module.
照射.
- Only hold LCD module by its sides. Never hold LCD module by - 液晶显示模块极易受静电损坏,请务必保证液
applying force on the heat seal or TAB.
晶显示模块在防静电的工作环境中使用或保
- When soldering, control the temperature and duration avoid
存。(如: 烙铁正确接地,等)
damaging the backlight guide or diffuser which might degrade the - 拿取液晶显示模块时需注意操作人员的接地情
display result such as uneven display.
况。
- Never let LCD module contact with corrosive liquids, which might - 请手持液晶显示模块的边沿取放模块,防止热
cause damage to the backlight guide or the electric circuit of LCD
压纸或 TAB 部位受力。
module.
- 焊接液晶模块时,请注意控制烙铁的温度、焊
- Only clean LCD with a soft dry cloth, Isopropyl Alcohol or Ethyl
接时间,以免烫坏导光板或偏光片,导致显示
Alcohol. Other solvents (e.g. water) may damage the LCD.
不匀等不良现象发生。
- Never add force to components of LCD module. It may cause - 请勿使用洗板水等腐蚀性液体接触液晶模块,
invisible damage or degrade the module's reliability.
以免腐蚀导光板或模块电路。
- When mounting LCD module, please make sure it is free from
twisting, warping and bending.
- 仅可使用柔软的干布, 异丙醇或乙醇清洁液晶
- Do not add excessive force on surface of LCD, which may cause
屏表面,其他任何溶剂(如:水)都有可能损坏液
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the display color change abnormally.
晶模块。
- LCD panel is made with glass. Any mechanical shock (e.g. - 请勿挤压液晶显示模块上的元器件,以避免产
dropping from high place) will damage the LCD module.
生潜在的损坏或失效而影响产品可靠性。
- 装配液晶显示模块时,请务必注意避免液晶显
示模块的扭曲或变形。
- 请勿挤压液晶显示屏表面,这将导致显示颜色
的异常。
- 液晶屏由玻璃制作而成,任何机械碰撞(如从高
处跌落)均有可能损坏液晶显示模块。
- Protective film is attached on LCD screen. Be careful when - 液晶屏表面带有保护膜, 揭除保护膜时需要注
peeling off this protective film, since static electricity may be
意可能产生的静电。
generated.
- 因液晶显示屏表面的偏光片极易划伤,安装完
- Polarizer on LCD gets scratched easily. If possible, do not remove
成之前请尽量不要揭下保护膜。
LCD protective film until the last step of installation.
- 请缓慢揭除保护膜,在此过程中液晶显示屏上
- When peeling off protective film from LCD, static charge may
可能会产生静电线,此为正常情况,可在短时
cause abnormal display pattern. The symptom is normal, and it
间内消失。
will turn back to normal in a short while.
- LCD panel has sharp edges, please handle with care.
- 请注意避免被液晶显示屏的边缘割伤。
- Never attempt to disassemble or rework LCD module.
- 请不要试图拆卸或改造液晶显示模块。
- If display panel is damaged and liquid crystal substance leaks out, - 当液晶显示屏出现破裂, 内部液晶液体可能流
be sure not to get any in your mouth, if the substance comes into
出; 相关液体不可吞吃, 绝对不可接触嘴巴,
contact with your skin or clothes promptly wash it off using soap
如接触到皮肤或衣服, 请使用肥皂与清水彻底
and water.
清洗.
10. CTP Mounting Instructions
8. 电容触摸屏安装指导
8.1 Bezel Mounting (Figure 1)
8.1 面框安装(附图 1)
- The bezel window should be bigger than the CTP active area. It
- 客户面框窗口应大于 CTP 动作区域,各边离动
should be ≥ 0.5mm each side.
作区应≥0.5mm.
- Gasket should be installed between the bezel and the CTP
- 面框与 CTP 面板间应垫有胶垫,其最终间隙约
surface.
为 0.5~1.0mm.
The final gap should be about 0.5~1.0mm.
- 建议必要时在背面提供附加支架(例如无安装结
- It is recommended to provide an additional support bracket for
构的薄型 TFT 模块),应仅利用适当支撑以保持
backside support when necessary (e.g. slim type TFT module
模块位置.
without mounding structure). They should only provide appropriate
support and keep the module in place.
- The mounting structure should be strong enough to prevent
- 安装结构应具有足够的强度,以防止外部不均
external uneven force or twist act onto the module.
匀力或扭曲力作用到模块上.
Figure
1
8.2 Surface Mounting (Figure 2)
8.2 嵌入安装(附图 2)
- As the CTP assembling on the countersink area with double side - 客户面框应具有使用双面胶粘贴 CTP 的结构沉
adhesive.
台面,其粘贴面要求平整且洁净无污以保证粘
The countersink area should be flat and clean to ensure the
贴牢靠.
double side adhesive installation result.
- The Bezel is recommend to keep a gap ( 0.3mm each side)
around the cover lens for tolerance.
- 考虑到制作误差,建议面框与 CTP 盖板之间四
- It is recommended to provide an additional support bracket with
周留有≥0.3mm 间隙.
gasket for backside support when necessary (e.g. TFT module - 建议必要时在背面提供垫有胶垫附加支架(例如
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without mounding structure). They should only provide appropriate
无安装结构的 TFT 模块),应仅利用适当支撑以
support and keep the module in place.
保持模块位置.
- The mounting structure should be strong enough to prevent
external uneven force or twist act onto the module
- 安装结构应具有足够的强度,以防止外部不均
匀力或扭曲力作用到模块上。
Figure 2
8.3 Additional Cover Lens Mounting (Figure 3)
8.3 覆加盖板(附图 3)
- For the case of additional cover Lens mounting, it is necessary to - 需要覆加玻璃盖板的安装,为确保其功能,有
recheck with the CTP specification about the material and
必要查看产品规格书中有关盖板材料和厚度的
thickness to ensure the functionality.
说明.
- It should keep a 0.2~0.3mm gap between the cover lens and the
CTP surface..
- 玻璃盖板与 CTP 表面之间应留有 0.2~0.3mm
- The cover lens window should be bigger than the active area of
隙.
the CTP.It should be ≥ 0.5mm each side.
- It is recommended to provide an additional support bracket for - 玻璃盖板视窗应大于 CTP 动作区域,各边离动
backside support when necessary (e.g. slim type TFT module
作区应≥0.5mm。
without mounding structure). They should only provide appropriate - 建议必要时在背面提供附加支架(例如无安装结
support and keep the module in place.
构的薄型 TFT 模块),应仅利用适当支撑以保持
- The mounting structure should be strong enough to prevent
模块位置.
external uneven force or twist act onto the module.
- 安装结构应具有足够的强度,以防止外部不均
匀力或扭曲力作用到模块上.
Figure
3
11. RTP Mounting Instructions
9. 电阻触摸屏安装指导
- 为避免面框直接压在动作区(A.A.)上造成误动
- It should bezel touching the RTP Active Area (A.A.) to prevent
作,面框与电阻触摸屏(RTP)之间应留有一定的
abnormal touch.It should left gab D=0.2~0.3mm in between.
空隙 D=0.2~0.3mm 之间.(附图 4)
(Figure 4)
- Outer bezel design should take care about the area outside the
- 设计面框时,要注意用面框保护触摸屏四周的非
A.A. Those areas contain circuit wires which is having different
保证操作区域,因为布线区域在此处形成一台
thickness. Touching those areas could de-form the ITO film. As a
阶,在此区域附近操作时 ITO Film 变形较大,
result bezel the ITO film be damaged and shorten its lifetime.
容易导致 ITO 损坏而降低寿命。为保护 RTP 和
It is suggested to protect those areas with gasket (between the
避免误操作,在 RTP 与面框之间垫缓冲物
bezel and RTP).The suggested figures are B≥0.50mm;
(Gasket),我们建议设计面框应覆盖动作区
C≥0.50mm. (Figure 4)
的边缘,面框边缘到 V.A.区的距离 B≥0.50mm;
垫圈内边缘到 V.A.区的距离 C≥0.50mm. (附图
4)
- The bezel side wall should keep space E= 0.2 ~ 0.3mm from the
- 在设计面框与 RTP 组装时,应考虑到面框内侧与
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RTP. (Figure 4)
RTP 外侧的间距 E≥0.2mm. (附图 4)
Figure 4
- In general design,
- 通常设计时:
RTP V.A. should be bigger than the TFT V.A.
RTP 的可视区 V.A. 应不小于 TFT 的可视区
and RTP A.A. should be bigger than the TFT A.A.
V.A.
(Figure 5)
及 RTP 的动作区 A.A. 应不小于 TFT 的动作区
A.A.
(附图 5)
Figure 5
Warranty
This product has been manufactured to our company’s specifications as a part for use in your company’s general
electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from
general electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power
control equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct
risk to human life and where extremely high levels of reliability are required. If the product is to be used in any of the
above applications, we will need to enter into a separate product liability agreement.
- We cannot accept responsibility for any defect, which may arise form additional manufacturing of the product
(including disassembly and reassembly), after product delivery.
- We cannot accept responsibility for any defect, which may arise after the application of strong external force to the
product.
- We cannot accept responsibility for any defect, which may arise due to the application of static electricity after the
product has passed our company’s acceptance inspection procedures.
- When the product is in CCFL models, CCFL service life and brightness will vary according to the performance of the
inverter used, leaks, etc. We cannot accept responsibility for product performance, reliability, or defect, which may
arise.
- We cannot accept responsibility for intellectual property of a third part, which may arise through the application of
our product to our assembly with exception to those issues relating directly to the structure or method of
manufacturing of our product.
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