LMT080DIEFWU-4
LCD Module User Manual
Prepared by:
Checked by:
Approved by:
Song Mao
Date: 2021-12-11
Date:
Date:
Rev. Descriptions
Edit
Release Date
0.1
Preliminary release
Song Mao
2021-12-11
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Table of Content
1. General Specification ............................................................................................................................... 3
2. Block Diagram ............................................................................................................................................ 3
3. Terminal Function ..................................................................................................................................... 4
3.1 K1 TFT Input Terminal ..................................................................................................................................................................... 4
3.2 K2 (Backlight connector) ................................................................................................................................................................. 5
4. Absolute Maximum Ratings .................................................................................................................... 5
5. Electrical Characteristics ........................................................................................................................ 5
5.1 DC Characteristics ........................................................................................................................................................................... 5
5.2 Current Consumption ....................................................................................................................................................................... 5
5.3 LED Backlight Circuit Characteristics ............................................................................................................................................ 5
6. Power Sequence ........................................................................................................................................ 6
6.1 Power on: ........................................................................................................................................................................................... 6
6.2 Power off: ........................................................................................................................................................................................... 6
6.3 Timing Characteristics ..................................................................................................................................................................... 7
6.4 Recommended Timing Setting Of TCON ..................................................................................................................................... 7
6.5 Input Clock and Data timing Diagram: .......................................................................................................................................... 8
6.6 Horizontal input timing Diagram: .................................................................................................................................................... 8
7. Optical Characteristics ............................................................................................................................. 9
8. LCD Module Design and Handling Precautions .............................................................................. 11
9. CTP Mounting Instructions ................................................................................................................... 12
10. RTP Mounting Instructions ................................................................................................................. 13
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1. General Specification
Screen Size(Diagonal) :
8.0”
Active Area :
162.0 x 121.5 (mm)
Number of dots :
800 (RGB) x 600
Pixel Pitch :
0.2025x0.2025(mm)
Color Depth:
16.7M colors
Display Technology :
a-Si TFT active matrix
Display Mode :
Normal White, Transmissive
Display Interface :
24-bits RGB
Viewing Direction :
6 o’clock(Gray scale Inversion) (*1)
12 o’clock (*2)
Surface Treatment :
Anti-Glare(Cover glass)
Operating Temperature :
-20 ~ +70°C
Storage Temperature :
-30 ~ +80°C
2. Block Diagram
800(x3) x 600 pixels
TFT Panel
R0~R7, B0~B7, G0~G7
DCLK, DE, VS, HS
Source Driver
MODE, RESET, DITHB
L/R, U/D
Vcc, GND, V COM, AV DD
V GL, V GH
Power Circuit
BLA, BLK
Backlight
Figure 1
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3. Terminal Function
3.1 K1 TFT Input Terminal
Pin No.
Pin Name
I/O
Descriptions
1
:
NC
-
No Connection
4
5
GND
Power
Power GND (0V)
6
V COM
Input
Common voltage
7
Vcc
Power
Power for Digital Circuit
8
MODE
Input
DE/SYNC mode select (*1)
9
DE
Input
Data input enable
10
VS
Input
Vertical Sync Input
11
HS
Input
Horizontal Sync Input
12
B7
:
:
Input
8bit Data for Blue
19
B0
20
G7
:
:
Input
8bit Data for Green
27
G0
28
R7
:
:
Input
8bit Data for Red
35
R0
36
GND
Power
Power GND (0V)
37
DCLK
Input
Sample clock(*2)
38
GND
Power
Power GND (0V)
39
L/R
Input
Left / right selection (*3)
40
U/D
Input
Up/down selection (*3)
41
V GH
Power
Gate ON Voltage
42
V GL
Power
Gate OFF Voltage
43
AV DD
Power
Power for Analog Circuit
44
RESET
Input
Global reset pin (*4)
45
NC
-
No connection
46
V COM
Input
Common Voltage
47
DITHB
Input
Dithering function (*5)
48
GND
Power
Power GND (0V)
49
NC
-
50
NC
No connection
Note:
* 1: When select DE mode, MODE=”1”.
When select SYNC mode, MODE= “0”.
* 2: Data shall be latched at the falling edge of DCLK.
* 3: Selection of scanning mode
Setting of scan control input
Scanning direction
U/D
L/R
GND
Vcc
Up to down, left to right
Vcc
GND
Down to up, right to left
GND
GND
Up to down, right to left
Vcc
Vcc
Down to up, left to right
*4: Global reset pin. Active low to enter reset state. Suggest to connect with an RC reset circuit for stability. Normally pull high.
*5: Dithering function enable control, normally pull high.
When DITHB= ” 0 ” , Disable internal dithering function. For 18bit RGB interface, connect two LSB bits of all the R/G/B data
buses to GND.
When DITHB= ” 1 ” , Enable internal dithering function, For TTL 24 bits parallel RGB image data input.
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3.2
K2 (Backlight connector)
Pin No. Pin Name
IO
Descriptions
Wire Color
1
BLA
Power
LED driving anode (high voltage)
Red
2
BLK
Power
LED driving cathode (low voltage)
Black
4. Absolute Maximum Ratings
Items
Symbol
Min.
Max.
Unit
Condition
Power voltage
Vcc
-0.3
3.96
V
AV DD
-0.5
14.85
V
Operating Temperature
T OP
-20
70
C
No Condensation
Storage Temperature
T ST
-30
80
C
No Condensation
Note:
*1. This rating applies to all parts of the module. And should not be exceeded.
*2. The operating temperature only guarantees operation of the circuit. The contrast, response speed,
and the other specification related to electro-optical display quality is determined at the room temperature, T OP =25.
*3. Ambient temperature when the backlight is lit (reference value)
*4. Any Stresses exceeding the Absolute Maximum Ratings may cause substantial damage to the device. Functional
operation of this device at other conditions beyond those listed in the specification is not implied and prolonged
exposure to extreme conditions may affect device reliability.
5. Electrical Characteristics
5.1 DC Characteristics
Vcc=3.3V,GND=0V,T a =25 C
Items
Symbol
Min.
Typ.
Max.
Unit
Remark
Vcc
3.2
3.3
3.4
V
*2
Power voltage
AV DD
12.4
12.6
12.8
V
V GH
21
22
23
V
V GL
-7.4
-6.9
-6.4
V
Input signal voltage
V COM
4.05
4.1
4.15
V
Input logic high voltage
V IH
0.7Vcc
-
Vcc
V
Input logic low voltage
V IL
0
-
0.3Vcc
V
*3
Note:
*1.Be sure to apply VCC and VGL to the LCD first, and then apply VGH.
*2: VCC setting should match the signals output voltage (refer to Note 3) of customer’s system board.
*3: DCLK,HS,VS,RESET,U/D, L/R,DE,R0~R7,G0~G7,B0~B7,MODE,DITHB.
5.2 Current Consumption
Vcc=3.3V,GND=0V,T a =25 C
Items
Symbol
Min.
Typ.
Max.
Unit
Remark
I VGH
-
0.4
-
mA
V GH = 22.0V
Current for Driver
I VGL
-
0.4
-
mA
V GL = -6.9V
I VCC
-
6.5
15.0
mA
V DD =3.3V
I AV DD
-
14
25
mA
AV DD =12.6V
5.3 LED Backlight Circuit Characteristics
Top=25 ℃
Items
Symbol
MIN.
TYP.
MAX.
Unit
Note
Forward Voltage
Vf BLA
8.7
9.6
10.3
V
If=200mA
Forward Current
If BLA
-
200.0
250
mA
Cautions:
Exceeding the recommended driving current could cause substantial damage to the backlight and shorten its lifetime.
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6. Power Sequence
6.1 Power on:
Figure 2
6.2 Power off:
Figure 3
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AC Characteristics
6.3 Timing Characteristics
Item
Symbol
MIN.
TYP.
MAX.
Unit
Remark
DCLK Frequency
Fclk
34.5
39.6
50.4
ns
DCLK Cycle Time
Tcph
14.1
15.4
-
ns
DCLK Pulse duty
Tcw
40
50
60
%
VSD Setup Time
Tvst
5
-
-
ns
VSD Hold Time
Tvhd
5
-
-
ns
HSD Setup Time
Thst
5
-
-
ns
HSD Hold Time
Thhd
5
-
-
ns
Data Setup Time
Tdsu
5
-
-
ns
Data to DCLK
Data Hold Time
Tdhd
5
-
-
ns
Data to DCLK
DE Setup Time
Tesu
5
-
-
ns
DE Hold Time
Tehd
5
-
-
ns
6.4 Recommended Timing Setting Of TCON
TCON (Embedded In Source IC) Input Timing (DCLK, HSD, VSD, DE)
VCC=3.3V, AVDD=12.6V, AGND=GND=0V, Ta=25 ℃
Item
Symbol
MIN.
TYP.
MAX.
Unit
Remark
F clk
34.5
39.6
50.4
MHZ
DCLK
t clk
14.1
15.4
-
ns
t h
900
1000
1200
t clk
t hd
-
800
-
t clk
HSD
t hpw
1
-
40
t clk
t hb
-
88
-
t clk
t hfp
12
112
312
t clk
t v
640
660
700
t h
t vd
-
600
-
t h
VSD
t vpw
1
-
20
t h
t vb
39
39
39
t h
t vfp
1
21
61
t h
Note: DE timing refer to HSD,VSD input timing.
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6.5 Input Clock and Data timing Diagram:
Figure 4
6.6 Horizontal input timing Diagram:
Figure 5
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7. Optical Characteristics
Test Conditions:
1. I F = 20mA(each LED), and the ambient temperature is 25 ℃ .
2. The test systems refer to Note 1 and Note 2.
Vcc=3.3V,GND=0V,T a =25 C
Item
Symbol
Condition
MIN.
TYP.
MAX.
UNIT
Note.
θ L
9 o’clock
60
70
-
Viewing angle
θ R
3 o’clock
60
70
-
(CR ≥ 10)
degree
Note 2
θ T
12 o’clock
40
50
-
θ B
6 o’clock
60
70
-
T f
Response Time
-
25
30
ms
Note 1
T r
Note 4
Normal
Contrast ratio
CR
θ= φ =0 o
400
500
-
-
Note 1,3
Color
X
0.26
0.31
0.36
-
Note 1
chromaticlty
White
Y
0.28
0.33
0.38
-
Note 5
Luminance
L
-
570
700
-
cd/m 2
Note 1,6
Luminance uniformity
Y U
-
70
75
-
%
Note 1,7
Note 1: Definition of optical measurement system.
The optical characteristics should be measured in dark room. After 5 Minutes operation, the optical
properties are measured at the center point of the LCD screen. All input terminals LCD panel must
be ground when measuring the center area of the panel.
Figure 6
Note 2: Definition of viewing angle range
Figure 7
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Note 3: Definition of contrast ratio
Note 4: Definition of Response time
The response time is defined as the LCD optical switching time interval between “White” state and
“Black” state. Rise time (T ON ) is the time between photo detector output intensity changed from
90% to 10%. And fall time (T OFF ) is the time between photo detector output intensity changed from
10% to 90%.
Figure 8
Note 5: Definition of color chromaticity (CIE1931)
Color coordinates measured at center point of LCD.
Note 6: Definition of Luminance Uniformity
Active area is divided into 9 measuring areas (Refer Fig. 2). Every measuring point is placed at the
center of each measuring area.
Luminance Uniformity (U) = Lmin/ Lmax
L-------Active area length W----- Active area width
Figure 9
Lmax: The measured Maximum luminance of all measurement position.
Lmin: The measured Minimum luminance of all measurement position.
Note 7: Definition of Luminance:
Measure the luminance of white state at center point.
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8. LCD Module Design and Handling
8. 液晶显示模块设计和使用须知
Precautions
- Please ensure V0, VCOM is adjustable, to enable LCD module - 请注意 V0, VCOM 的设定, 以确保液晶显示
get the best contrast ratio under different temperatures, view
模块在不同的使用温度下以及在不同的视
angles and positions.
角和位置观察模块显示,均能达到最佳对
比度,请务必将应用电路上设置为对比度
- Normally display quality should be judged under the best contrast
可调。
ratio within viewable area. Unexpected display pattern may com - 请注意液晶显示模块的显示品质判定是指
out under abnormal contrast ratio.
在正常对比度下以及视窗(V.A)范围内进行
- Never operate the LCD module exceed the absolute maximum
的,非正常对比度下液晶可能会出现非预
ratings.
期的显示不良,应注意区分。
- Never apply signal to the LCD module without power supply.
- 请勿在最大额定值以外使用液晶显示模
块。
- Keep signal line as short as possible to reduce external noise
interference.
- 请勿在没有接通电源的条件下,给液晶显
- IC chip (e.g. TAB or COG) is sensitive to light. Strong light might
示模块输送信号。
cause malfunction. Light sealing structure casing is - 请尽可能缩短信号线的连接,以避免对液
recommended.
晶显示模块的信号干扰。
- 集成电路因 IC 芯片(如 TAB 或 COG)对紫外
- Make sure there is enough space (with cushion) between case
线极为敏感,强光环境下可能会引起液晶
and LCD panel, to prevent external force passed on to the panel;
显示模块功能失效,故应采用不透光的外
otherwise that may cause damage to the LCD and degrade its
壳。
display result.
- 请在液晶显示模块与外壳之间保留足够的
- Avoid showing a display pattern on screen for a long time
空间(可使用衬垫),以缓冲外力对液晶显
(continuous ON segment).
示模块的损坏或因受力不均而产生的显示
不匀等异常现象。
- LCD module reliability may be reduced by temperature shock.
- When storing and operating LCD module, avoids exposure to - 避免液晶显示屏在某一画面下长时间点
direct sunlight, high humidity, high or low temperature. They may
亮,否则有出现残影的风险;请通过软件
damage or degrade the LCD module.
每隔一段时间改变一次画面。
- Never leave LCD module in extreme condition (max./min - 液晶显示模块的可靠性可能因温度冲击而
storage/operate temperature) for more than 48hr.
降低。
- Recommend LCD module storage conditions is 0 C~40 C - 请勿在阳光直射、高湿、高温或低温下储
<80%RH.
存和使用液晶显示模块,这将造成液晶显
- LCD module should be stored in the room without acid, alkali and
示模块的损坏或失效。
harmful gas.
- Avoid dropping & violent shocking during transportation, and no - 请勿在极限环境(最大/最小存储/工作温
excessive pressure press, moisture and sunlight.
度)下使用或放置液晶显示模块超过 48 小
- LCD module can be easily damaged by static electricity. Please
时以上。
maintain an optimum anti-static working environment to protect - 液晶显示模块建议存储条件为: 0 C~40 C
the LCD module. (eg. ground the soldering irons properly)
<80%RH 。
- Be sure to ground the body when handling LCD module.
- 请勿让液晶显示模块存储于带有 酸性, 碱
- Only hold LCD module by its sides. Never hold LCD module by
性, 有害气体环境之中。
applying force on the heat seal or TAB.
- 在运输过程中, 请勿让液晶显示模块跌落
- When soldering, control the temperature and duration avoid
与猛烈震动, 同时避免 异常挤压, 高湿
damaging the backlight guide or diffuser which might degrade the
度, 与阳光照射.
display result such as uneven display.
- 液晶显示模块极易受静电损坏,请务必保
- Never let LCD module contact with corrosive liquids, which might
证液晶显示模块在防静电的工作环境中使
cause damage to the backlight guide or the electric circuit of LCD
用或保存。(如: 烙铁正确接地,等)
module.
- 拿取液晶显示模块时需注意操作人员的接
- Only clean LCD with a soft dry cloth, Isopropyl Alcohol or Ethyl
地情况。
Alcohol. Other solvents (e.g. water) may damage the LCD.
- 请手持液晶显示模块的边沿取放模块,防
- Never add force to components of LCD module. It may cause
止热压纸或 TAB 部位受力。
invisible damage or degrade the module's reliability.
- 焊接液晶模块时,请注意控制烙铁的温
- When mounting LCD module, please make sure it is free from
度、焊接时间,以免烫坏导光板或偏光
twisting, warping and bending.
片,导致显示不匀等不良现象发生。
- Do not add excessive force on surface of LCD, which may cause - 请勿使用洗板水等腐蚀性液体接触液晶模
the display color change abnormally.
块,以免腐蚀导光板或模块电路。
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- LCD panel is made with glass. Any mechanical shock (e.g.
dropping from high place) will damage the LCD module.
- 仅可使用柔软的干布, 异丙醇或乙醇清洁
液晶屏表面,其他任何溶剂(如:水)都有可
能损坏液晶模块。
- 请勿挤压液晶显示模块上的元器件,以避
免产生潜在的损坏或失效而影响产品可靠
性。
- 装配液晶显示模块时,请务必注意避免液
晶显示模块的扭曲或变形。
- 请勿挤压液晶显示屏表面,这将导致显示
颜色的异常。
- 液晶屏由玻璃制作而成,任何机械碰撞(如
从高处跌落)均有可能损坏液晶显示模块。
- Protective film is attached on LCD screen. Be careful when - 液晶屏表面带有保护膜, 揭除保护膜时需
peeling off this protective film, since static electricity may be
要注意可能产生的静电。
generated.
- 因液晶显示屏表面的偏光片极易划伤,安
- Polarizer on LCD gets scratched easily. If possible, do not remove
装完成之前请尽量不要揭下保护膜。
LCD protective film until the last step of installation.
- 请缓慢揭除保护膜,在此过程中液晶显示
- When peeling off protective film from LCD, static charge may
屏上可能会产生静电线,此为正常情况,
cause abnormal display pattern. The symptom is normal, and it
可在短时间内消失。
will turn back to normal in a short while.
- LCD panel has sharp edges, please handle with care.
- 请注意避免被液晶显示屏的边缘割伤。
- Never attempt to disassemble or rework LCD module.
- 请不要试图拆卸或改造液晶显示模块。
- If display panel is damaged and liquid crystal substance leaks out, - 当液晶显示屏出现破裂, 内部液晶液体可
be sure not to get any in your mouth, if the substance comes into
能流出; 相关液体不可吞吃, 绝对不可接
contact with your skin or clothes promptly wash it off using soap
触嘴巴, 如接触到皮肤或衣服, 请使用肥
and water.
皂与清水彻底清洗.
9. CTP Mounting Instructions
9. 电容触摸屏安装指导
9.1 Bezel Mounting (Figure 1)
9.1 面框安装(附图 1)
- The bezel window should be bigger than the CTP active area. It
- 客户面框窗口应大于 CTP 动作区域,各边
should be ≥ 0.5mm each side.
离动作区应≥0.5mm.
- Gasket should be installed between the bezel and the CTP
- 面框与 CTP 面板间应垫有胶垫,其最终间
surface.
隙约为 0.5~1.0mm.
The final gap should be about 0.5~1.0mm.
- 建议必要时在背面提供附加支架(例如无安
- It is recommended to provide an additional support bracket for
装结构的薄型 TFT 模块),应仅利用适当支
backside support when necessary (e.g. slim type TFT module
撑以保持模块位置.
without mounding structure). They should only provide appropriate
support and keep the module in place.
- The mounting structure should be strong enough to prevent
- 安装结构应具有足够的强度,以防止外部
external uneven force or twist act onto the module.
不均匀力或扭曲力作用到模块上.
Figure
1
9.2 Surface Mounting (Figure 2)
9.2 嵌入安装(附图 2)
- As the CTP assembling on the countersink area with double side - 客户面框应具有使用双面胶粘贴 CTP 的结
adhesive.
构沉台面,其粘贴面要求平整且洁净无污
The countersink area should be flat and clean to ensure the
以保证粘贴牢靠.
double side adhesive installation result.
- The Bezel is recommend to keep a gap ( ≥ 0.3mm each side)
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around the cover lens for tolerance.
- 考虑到制作误差,建议面框与 CTP 盖板之
- It is recommended to provide an additional support bracket with
间四周留有≥0.3mm 间隙.
gasket for backside support when necessary (e.g. TFT module - 建议必要时在背面提供垫有胶垫附加支架
without mounding structure). They should only provide appropriate
(例如无安装结构的 TFT 模块),应仅利用
support and keep the module in place.
适当支撑以保持模块位置.
- The mounting structure should be strong enough to prevent
external uneven force or twist act onto the module
- 安装结构应具有足够的强度,以防止外部
不均匀力或扭曲力作用到模块上。
Figure 2
9.3 Additional Cover Lens Mounting (Figure 3)
9.3 覆加盖板(附图 3)
- For the case of additional cover Lens mounting, it is necessary to - 需要覆加玻璃盖板的安装,为确保其功
recheck with the CTP specification about the material and
能,有必要查看产品规格书中有关盖板材
thickness to ensure the functionality.
料和厚度的说明.
- It should keep a 0.2~0.3mm gap between the cover lens and the
CTP surface..
- 玻璃盖板与 CTP 表面之间应留有 0.2~
- The cover lens window should be bigger than the active area of
0.3mm 间隙.
the CTP.It should be ≥ 0.5mm each side.
- It is recommended to provide an additional support bracket for - 玻璃盖板视窗应大于 CTP 动作区域,各边
backside support when necessary (e.g. slim type TFT module
离动作区应≥0.5mm。
without mounding structure). They should only provide appropriate - 建议必要时在背面提供附加支架(例如无安
support and keep the module in place.
装结构的薄型 TFT 模块),应仅利用适当支
- The mounting structure should be strong enough to prevent
撑以保持模块位置.
external uneven force or twist act onto the module.
- 安装结构应具有足够的强度,以防止外部
不均匀力或扭曲力作用到模块上.
Figure
3
10. RTP Mounting Instructions
10. 电阻触摸屏安装指导
- 为避免面框直接压在动作区(A.A.)上造成误
- It should bezel touching the RTP Active Area (A.A.) to prevent
动作,面框与电阻触摸屏(RTP)之间应留有
abnormal touch.It should left gab D=0.2~0.3mm in between.
一定的空隙 D=0.2~0.3mm 之间.(附图 4)
(Figure 4)
- Outer bezel design should take care about the area outside the
- 设计面框时,要注意用面框保护触摸屏四周
A.A. Those areas contain circuit wires which is having different
的非保证操作区域,因为布线区域在此处
thickness. Touching those areas could de-form the ITO film. As a
形成一台阶,在此区域附近操作时 ITO
result bezel the ITO film be damaged and shorten its lifetime.
Film 变形较大,容易导致 ITO 损坏而降低
It is suggested to protect those areas with gasket (between the
寿命。为保护 RTP 和避免误操作,在 RTP
bezel and RTP).The suggested figures are B≥0.50mm;
与面框之间垫缓冲物(Gasket),我们建
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LCD Module User Manual
LMT080DIEFWU-4
C≥0.50mm. (Figure 4)
议设计面框应覆盖动作区的边缘,面框边
缘到 V.A.区的距离 B≥0.50mm; 垫圈内边
缘到 V.A.区的距离 C≥0.50mm. (附图 4)
- The bezel side wall should keep space E= 0.2 ~ 0.3mm from the
- 在设计面框与 RTP 组装时,应考虑到面框内
RTP. (Figure 4)
侧与 RTP 外侧的间距 E≥0.2mm. (附图 4)
Figure 4
- In general design,
- 通常设计时:
RTP V.A. should be bigger than the TFT V.A.
RTP 的可视区 V.A. 应不小于 TFT 的可视
and RTP A.A. should be bigger than the TFT A.A.
区 V.A.
(Figure 5)
及 RTP 的动作区 A.A. 应不小于 TFT 的动
作区 A.A.
(附图 5)
Figure 5
Warranty
This product has been manufactured to our company’s specifications as a part for use in your company’s general
electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from
general electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power
control equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct
risk to human life and where extremely high levels of reliability are required. If the product is to be used in any of the
above applications, we will need to enter into a separate product liability agreement.
- We cannot accept responsibility for any defect, which may arise form additional manufacturing of the product
(including disassembly and reassembly), after product delivery.
- We cannot accept responsibility for any defect, which may arise after the application of strong external force to the
product.
- We cannot accept responsibility for any defect, which may arise due to the application of static electricity after the
product has passed our company’s acceptance inspection procedures.
- When the product is in CCFL models, CCFL service life and brightness will vary according to the performance of the
inverter used, leaks, etc. We cannot accept responsibility for product performance, reliability, or defect, which may
arise.
- We cannot accept responsibility for intellectual property of a third part, which may arise through the application of
our product to our assembly with exception to those issues relating directly to the structure or method of
manufacturing of our product.
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